“…The evaluated substrates were ceramic substrates (Al 2 O 3 , Kyocera Fineceramics GmbH, Esslingen am Neckar, Germany), polyimide foils of 30 µm thickness (DUPONT TM Kapton ® HN, DuPont de Nemours, Neu Isenburg, Germany), and foils of 9 µm thickness fabricated by spin-on polyimide precursor (HD Microsystems PI 2611, HD MicroSystems TM , Neu-Isenburg, Germany) adhered to a 4"-borofloat glass wafer with chromium bonding layer (according to [15]). Structuring of substrates, necessary for electrical characterization, was realized by adherent shadow masks, shown in Figure 1.…”