Fractional Moore-Gibson-Thompson heat transfer model with two-temperature and non-singular kernels for 3D thermoelastic solid

Abouelregal, Ahmed E.; Rayan, Alanazi

doi:10.1016/j.joes.2022.04.008

Cited by 9 publications

(4 citation statements)

References 54 publications

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“…The field equations and constitutive relations in the absence of body forces, body couples and heat source (Eringen, 25 Quintanilla 31 and Abouelregal and Alanazi 37 ), are as follows:…”

Section: Governing Equationsmentioning

confidence: 99%

“…Several comprehensive works have been presented that include MGT theory of thermoelasticity. [36][37][38][39][40][41][42] Several eminent researchers have investigated the thermomechanical properties of micropolar elastic media using various thermoelasticity theories. To the best of the authors' knowledge, no research has been conducted on the interaction of Eringen's non-local theory and micropolar thermoelastic materials with HTT under MGT for an axisymmetric problem.…”

Section: Introductionmentioning

confidence: 99%

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Analysis of axisymmetric deformation in generalized micropolar thermoelasticity within the framework of Moore-Gibson-Thompson heat equation incorporating non-local and hyperbolic two-temperature effect

Kumar,

Kaushal,

Kochar

2024

The Journal of Strain Analysis for Engineering Design

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An axisymmetric problem in micropolar thermoelastic model based on the Moore-Gibson-Thompson heat equation (MGT) under non-local and hyperbolic two-temperature (HTT) is explored due to mechanical loading. After transforming the system of equations into dimensionless form and employing potential functions, a new set of governing equations are solved using Laplace and Hankel transforms. A specific set of restrictions are applied on the boundary in the form of ring load and disk load for examining the significance of the problem. The transformed form of components of displacement, stresses, tangential couple stress, conductive temperature, and thermodynamic temperature are obtained. A numerical inversion technique is applied to recover the physical quantities in the original domain. The graphic representation of numerical findings for stress components, tangential couple stress, and conductive temperature reveals the impact of non-local and HTT parameters. Certain cases of interest are drawn out. Physical views presented in the article may be useful for the composition of new materials, geophysics, earthquake engineering, and other scientific disciplines.

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“…The field equations and constitutive relations in the absence of body forces, body couples and heat source (Eringen, 25 Quintanilla 31 and Abouelregal and Alanazi 37 ), are as follows:…”

Section: Governing Equationsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Analysis of axisymmetric deformation in generalized micropolar thermoelasticity within the framework of Moore-Gibson-Thompson heat equation incorporating non-local and hyperbolic two-temperature effect

Kumar,

Kaushal,

Kochar

2024

The Journal of Strain Analysis for Engineering Design

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“…[14] investigated the effect of two temperatures on wave thermomechanical loading to derive the thermodynamic and conductive temperature expressions. Abouelregal et al [15] Introduce A new thermoelasticity model based on fractional calculus in combination with Fourier's law of heat, and dual temperature theory is presented, including the Moore-Gibson-Thomson equation.…”

Section: Introductionmentioning

confidence: 99%

Photomechanical and Thermal Wave Responses of a Two-Temperature Semiconductor Model with Moisture Diffusivity Process

Elidy¹,

Lotfy

Tantawi

2023

Bulletin of Faculty of Science, Zagazig University

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In the context of the two-temperature thermoelasticity theory, a novel mathematical-physical model is introduced that describes the influence of moisture diffusivity in the semiconductor material. The Two-dimensional (2D) Cartesian coordinate is used to study the coupled between the thermo-elastic, plasma waves, and Moisture Diffusivity. Dimensionless quantities are the main physical fields in the Laplace transform domain. For the unknown variables, some conditions are applied at the free surface of the medium according to two temperature theory, to get the main quantities analytically. The Laplace transform technique has been applied with some numerical approximations in the time domain to obtain the exact expressions of the main physical fields. Due to the effects of the two temperature parameter, numerical results of silicon material have been introduced. The impacts of thermoelectric, thermoelastic, and reference moisture parameters have been discussed graphically.

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“…To get the expression for thermodynamic and conductive temperature, the impact of two temperatures on wave thermo-mechanical loading is investigated [14]. Abouelregal and others [15] introduced the Moore-Gibson-Thomson equation and a new thermoelasticity model based on fractional calculus, Fourier's law of heat, and dual temperature theory was presented.…”

Section: Introductionmentioning

confidence: 99%

Two-Temperature Semiconductor Model Photomechanical and Thermal Wave Responses with Moisture Diffusivity Process

et al. 2022

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In the context of the two-temperature thermoelasticity theory, a novel mathematical–physical model is introduced that describes the influence of moisture diffusivity in the semiconductor material. The two-dimensional (2D) Cartesian coordinate is used to study the coupling between the thermo-elastic plasma waves and moisture diffusivity. Dimensionless quantities are taken for the main physical fields with some initial conditions in the Laplace transform domain. The linear solutions are obtained analytically along with unknown variables when some conditions are loaded at the surface of the homogenous medium according to the two-temperature theory. The Laplace transform technique in inversion form is utilized with some numerical algebraic approximations in the time domain to observe the exact expressions. Due to the effects of the two-temperature parameter and moisture diffusivity, the numerical results of silicon material have been introduced. The impacts of thermoelectric, thermoelastic, and reference moisture parameters are discussed graphically with some physical explanations.

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Fractional Moore-Gibson-Thompson heat transfer model with two-temperature and non-singular kernels for 3D thermoelastic solid

Cited by 9 publications

References 54 publications

Analysis of axisymmetric deformation in generalized micropolar thermoelasticity within the framework of Moore-Gibson-Thompson heat equation incorporating non-local and hyperbolic two-temperature effect

Analysis of axisymmetric deformation in generalized micropolar thermoelasticity within the framework of Moore-Gibson-Thompson heat equation incorporating non-local and hyperbolic two-temperature effect

Photomechanical and Thermal Wave Responses of a Two-Temperature Semiconductor Model with Moisture Diffusivity Process

Two-Temperature Semiconductor Model Photomechanical and Thermal Wave Responses with Moisture Diffusivity Process

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