Fracture behavior of 63sn-37pb solder

Logsdon, W. A.; Liaw, Peter K.; Burke, M. A.

doi:10.1016/0013-7944(90)90001-w

Cited by 63 publications

(20 citation statements)

References 17 publications

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“…Hence, the grain boundaries of Cu 3 Sn can facilitate the crack propagation notably once the cracks initiated, leading to intergranular fracture in a Cu 3 Sn micro beam. And this fracture mode has also been observed by the other researchers [39]. Sn IMCs.…”

Section: Fracture Mechanisms Of Cu 6 Sn 5 and Cu 3 Sn Imcssupporting

confidence: 62%

Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending

et al. 2016

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Section: Fracture Mechanisms Of Cu 6 Sn 5 and Cu 3 Sn Imcssupporting

confidence: 62%

Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending

et al. 2016

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“…The load eventually vanishes at point P when the macrocrack extends fully across the specimen and a ductile shear fracture was observed. Microscopic examination of the etched fracture specimen shown in Figure 13 reveals that the shear band is similar to those found for plastically deformed Pb-rich phase along colony boundaries in the specimen fractured due to fatigue (Logsdon et al, 1990).…”

Section: Leaded Solder (64sn-36pb)mentioning

confidence: 79%

“…At 150 • C and at low frequencies it was found that the time to failure was constant and independent of the plastic strain range, while cycling at more than one temperature caused relatively little reduction in life compared to that observed in tests where the cycling was at a single temperature. Logsdon et al (1990) obtained the isothermal mechanical and fracture mechanics material properties of 63Sn-37Pb solder determined at −55, 24 and 125 • C. Tensile creep-rupture, fracture toughness, fatigue crack growth rate and creep tests were performed. Using scanning electron microscopy and Auger spectroscopy, ductile transgranular fracture was observed at −55 • C while ductile intergranular fracture was observed at room temperature.…”

Section: Introductionmentioning

confidence: 99%

Microscopic Experimental Investigation on Shear Failure of Solder Joints

et al. 2004

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A microscopic investigation has been made on the shearing of one leaded and two leadfree solders by using an in situ SEM method. A shear lap joint specimen is designed and fabricated to accommodate a thin layer of solder alloy between copper strips. A non-contact method that measures strains in a very narrow area in the solder was applied. A laser grid was also used on the copper strip for measuring the back-face strain. Simultaneously micrographs at various stages were also taken. Where in situ measurements and micrographs are recorded they can reveal the continual development of damage and fracture mechanisms consistent with observations generated by low-cycle fatigue loading. This means that the shear test can be used as an alternative test to fatigue loading tests. By comparison, two lead-free solder specimens showed much smaller elongation to failure than the leaded solder, although all specimens showed similar sequence of events leading to final failure, including the boundary layer fracture phenomenon. The back-face strain indicator for the formation of a macro crack is due to the shifting of high stress concentration area from the joint-edge region to outside the joint region as revealed by a damage-coupled finite element procedure. The procedure also provides an estimate on the critical back-face strain.

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“…[1][2][3][4][5][6][7][8] However, only limited research has been reported on fatigue crack growth behavior of solder materials. 9 Fatigue is a process of crack initiation and propagation, and it has been reported that crack propagation is dominant in determining the fatigue life of solder joints. 10 It is therefore reasonable that a crack growth curve would be used in the estimation of the life of a solder joint.…”

Section: Introductionmentioning

confidence: 99%