1992
DOI: 10.1016/0040-6090(92)90112-o
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Fracture strength and biaxial modulus measurement of plasma silicon nitride films

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Cited by 48 publications
(29 citation statements)
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“…Plasma enhanced chemical vapour deposition (PECVD) fabrication gives a strength of 390 MPa for silicon-rich composition and 420 MPa for nitrogen-rich composition [28,45]. Low pressure CVD (LPCVD) fabrication reportedly allows strengths as high as 5-8 GPa [28,29].…”
Section: Fabrication Of a Resonator With Nanoscale Silicon Nitridmentioning
confidence: 99%
“…Plasma enhanced chemical vapour deposition (PECVD) fabrication gives a strength of 390 MPa for silicon-rich composition and 420 MPa for nitrogen-rich composition [28,45]. Low pressure CVD (LPCVD) fabrication reportedly allows strengths as high as 5-8 GPa [28,29].…”
Section: Fabrication Of a Resonator With Nanoscale Silicon Nitridmentioning
confidence: 99%
“…Having obtained the necessary output power at 372 nm, we need a way to lock the laser wavelength to the wavelength of the 5 D 4 3 5 F 5 atomic transition. To do this, it is necessary to perform polarization spectroscopy on this transition (21). We need atomic Fe to observe this transition.…”
Section: Figmentioning
confidence: 99%
“…We applied polarization spectroscopy to this discharge. In polarization spectroscopy, Doppler broadening of the absorption profile is compensated for (21). This method theoretically enables us to obtain an error signal with a peak to peak width determined by the natural linewidth of the transition, ⌫͞2 ϭ 2.58 MHz for our target transition.…”
Section: Figmentioning
confidence: 99%
“…However, the fracture toughness of thin films can be very different from the ones measured from bulk materials due to the difference in microstructure and composition. In the available reports on thin film fracture toughness and fracture strength studies on silicon nitride, micro-bridge [17] or micro-bulge specimens [18] had to be fabricated by a lithographic approach, which is both expensive in sample making and inaccurate in result interpretation. For example, in the micro-bridge test, the residual stress in the films had to be estimated in order to calculate the fracture toughness of the thin film [19].…”
Section: Introductionmentioning
confidence: 99%
“…Due to the uncertainty on the residual stresses, the reported value for the critical stress intensity factor ranges from 1.8 ± 0.3 MPa·m 1 /2 for low-stress film to an upper bound value of 14 MPa·m 1 /2 for a high-stress film [17]. The micro-bulge test [18], however, can only yield information on the biaxial modulus and tensile fracture strength, not the fracture toughness of the film. No report is available for the fracture toughness and fracture strength of silicon oxynitride thin films.…”
Section: Introductionmentioning
confidence: 99%