2016
DOI: 10.1088/0960-1317/26/9/095009
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Fracture strength of glass chips for high-pressure microfluidics

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Cited by 15 publications
(15 citation statements)
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“…The simpler semi-circular channel geometry of the flow sensor allows for strength-comparisons using modeling to find the correlating fracture stress. The average fracture stress was 73 MPa which is about 40% less than the stresses seen for chips without electrodes, found in both our previous work [30] and the works of others [39][40]. This and the fact that the crack formation is irregular, following and exposing the metallization, suggest that metallization lowers the fracture strength and the integrated electrodes act as defects.…”
Section: Embedded Metal Layersmentioning
confidence: 47%
“…The simpler semi-circular channel geometry of the flow sensor allows for strength-comparisons using modeling to find the correlating fracture stress. The average fracture stress was 73 MPa which is about 40% less than the stresses seen for chips without electrodes, found in both our previous work [30] and the works of others [39][40]. This and the fact that the crack formation is irregular, following and exposing the metallization, suggest that metallization lowers the fracture strength and the integrated electrodes act as defects.…”
Section: Embedded Metal Layersmentioning
confidence: 47%
“…The pressure tolerance in glass chips is affected by stress corrosion, a temperature dependent effect that can cause 45% lower longterm pressure tolerance at 80 °C compared to ambient temperature. 38 Furthermore, embedded electrodes can also affect the strength. 30 Yet, the pressure tolerance also depends on channel dimensions, 19 and as the heating was localized to the narrow restrictor channels, this effect might be mitigated.…”
Section: ■ Discussionmentioning
confidence: 99%
“…For larger span, higher temperatures are needed in the actuator chip. The pressure tolerance in glass chips is affected by stress corrosion, a temperature dependent effect that can cause 45% lower long-term pressure tolerance at 80 °C compared to ambient temperature . Furthermore, embedded electrodes can also affect the strength .…”
Section: Discussionmentioning
confidence: 99%
“…Directly after bonding by a light pressure, the wafer stack was thermally treated at 625 °C under ambient pressure for 6 h. A detailed protocol is provided in previous work. 30 …”
Section: Methodsmentioning
confidence: 99%
“…Directly after bonding by a light pressure, the wafer stack was thermally treated at 625 ˚C under ambient pressure for 6 h. A detailed protocol is provided in previous work. 30 Next, thin-film electrodes were defined on the glass wafer stack. A flat top surface was achieved by recessing the electrodes into the glass.…”
Section: Experimental Fabrication Of the Heat-stagementioning
confidence: 99%