“…Most publications have dealt with reactive magnetron sputter deposition and the characterization of the physical properties of the Cu 3 N films as a function of deposition parameters: nitrogen (partial) pressure in the gas mixture, [15][16][17] substrate temperature, 7,18 and sputtering power. 19,20 Although Cu 3 N has been widely studied, little information is available in the literature concerning transition metal-doped Cu 3 N. Recently, some ternary compound based Cu 3 N have been grown; (Pd, Cu)N, 21 (Ti, Cu)N, 22 and (Ag, Cu)N. 23 Also, Moreno-Armenta et al 24 have theoretically studied the effect of metal insertion (M = Ni, Cu, Zn, Pd, Ag, and Cd) at the center of Cu 3 N unit cell on electronic structure.…”