Free Convection Heat Transfer from Vertical Fin-Arrays

Pol, D. Van de; Tierney, J. K.

doi:10.1109/tphp.1974.1134861

Cited by 44 publications

(13 citation statements)

References 5 publications

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“…This work was developed further for U-channels, representative of today's fin array heat sinks, by Starner and McManus [24], Van de Pol and Tierney [25] and Aihara and Maruyama [13]. For such geometries Ellison [26] derived a gray body radiative heat transfer analysis.…”

Section: Analytical and Semi-empirical Analysesmentioning

confidence: 99%

Air cooled heat sink design optimization in free convection

Rodgers¹,

Eveloy²

2013

29th IEEE Semiconductor Thermal Measurement and Management Symposium

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The optimization of heat sink performance is becoming ever more critical in passively air-cooled applications. In this paper, an overview of analytical, semi-empirical and Computational Fluid Dynamics (CFD)-based methodologies for air-cooled heat sink design optimization in free convection is presented. The advantages and potential limitations of these design techniques are summarized. A multi-faceted heat sink design strategy is advocated, which combines the analysis techniques presented with experimentation. The need to incorporate sustainability and formal optimization in the design process is highlighted.

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Section: Analytical and Semi-empirical Analysesmentioning

confidence: 99%

Air cooled heat sink design optimization in free convection

Rodgers¹,

Eveloy²

2013

29th IEEE Semiconductor Thermal Measurement and Management Symposium

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“…MAd K=2.419xlO-2 +6.339xlO-sr van de Pol and Tierney [13] suggested another heat transfer coefficient for inner plane of heat sinks, as shown in Eq. (3), and proposed that the distance between the individual heat sinks affects the boundary layer of heat sinks.…”

Section: Finite Element Simulationmentioning

confidence: 99%

Light degradation prediction of high-power light-emitting diode lighting modules

Yang

Chi

et al. 2010

2010 11th International Thermal, Mechanical &Amp; Multi-Physics Simulation, and Experiments in Microelectronics and Microsystem

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Light-emitting diode (LED), generally used for indicator light, has been developed for the past 50 years.Recently, LED has attracted many industries in the research and design of their products. However, its low electro-optical conversion efficiency causes redundant heat leading to increased junction temperature and decreased LED luminosity. In this research a detailed finite element method (FEM) model of a LED module with a proper estimated thermal power and boundary conditions is established using an ANSYS®finite element analysis software. Electrical test method (ETM) and thermocouple measurement are utilized to estimate junction temperature and heat sink temperature, as well as to validate the simulation results. Results from simulation agree with experiment results at a 5% deviation. In the life test of high-power LED modules, the six tested devices had different junction temperatures were conducted in this experiment. Luminosity variations are measured by the integral sphere measurement system. Experiment results show different junction temperatures will influence the light degradation mode. Therefore, it is imr0rtant to predict and control the junction temperature to Improve the LED performance. A detailed FEM model of a LED module is established to simulate the junction temperature. Then, the light degradation mode of this LED module is predicted by the simulation result. This method could rapidly predict the light degradation mode of high power LED lighting modules.

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“…However, environmental protection with the use of lamps remains critical. Lamp research and development (R&D) has used scientific and technological advancements to enhance the semiconductor components of light-emitting diodes (LEDs), including their high brightness, long life, low energy consumption, low pollution, lightness, and durability, while considering the importance of environmental protection [9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Effect of heat convection on the thermal and structure stress of high-power InGaN light-emitting diode

Hsu

Huang

2014

J Therm Anal Calorim

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In this study, two models are investigated:(1) the convection cooling of high-power indium-galliumnitride light-emitting diodes (LEDs) and (2) the effects of thermal stress distribution. The first model chip (model A) has power of 1 and 3 W and dimensions of 1 mm 9 1 mm 9 0.005 mm, whereas the second model chip (model B) has power of 6 and 10 W and dimensions of 1.8 mm 9 1.8 mm 9 0.005 mm. The results of an analysis of natural convection, forced cooling, and thermal stress are compared with 1, 3, 6, and 10 W thermal specification data. High heat conductivity Al 2 O 3 material used as a printed circuit board (PCB) facilitates the heat conduction and thermal cooling of high-power LEDs and thus increases the strength of the structure. This LED structure model is used in full-scale packaging structures. The wire bonding convection cooling and effect of thermal stress distribution of this packaging design are investigated. We simulate thermal performance and effect of thermal stress distribution of the LEDs using a finite element method with ANSYS software. Heat transfer is coupled with heat conduction, heat convection, and thermal radiation, with the distribution of thermal stress equivalent to that of the von Mises criterion stress. LED is attached to a silicon substrate by wire bonding; the die bond material used is epoxy. LED packaging material is important. If the LED lighting power is fixed, it can increase the convection cooling coefficient, decreases the T j temperature, and the distribution of structural stress. The T j temperature is stable when the heat transfer coefficient had a critical or optimal value. Thermal cooling performance and overall structural strength can be improved when the LED is mounted on the Al 2 O 3 PCB material and heat sink. The models are employed accurately to determine the heat transfer effect, structural strength, life span, performance enhancement, and efficiency.

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Free Convection Heat Transfer from Vertical Fin-Arrays

Cited by 44 publications

References 5 publications

Air cooled heat sink design optimization in free convection

Air cooled heat sink design optimization in free convection

Light degradation prediction of high-power light-emitting diode lighting modules

Effect of heat convection on the thermal and structure stress of high-power InGaN light-emitting diode

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