1983
DOI: 10.1121/1.389054
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Free vibration of cantilever quadrilateral plates

Abstract: In this paper, a numerical method for the free vibration analysis of cantilever quadrilateral plates of general shape is presented. Using quadrilateral coordinates and integral equation of beams, the expressions for the strain energy and kinetic energy have been developed. The formulation and derivation of equations are in the matrix form "ab initio." Then the eigenvalue problem is solved for frequencies and mode shapes. Numerical work has been done for particular cases and the results compared with those of o… Show more

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Cited by 24 publications
(14 citation statements)
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“…Consider now a sectorial plate domain having unit radius ( r ) , included angle ( a ) and polar co-ordinate origin at the reentrant corner of the skew plate shown in Figure 1 (12) Given that the power terms in r are non-zero, equation (1 1) reduces to which may be factored into…”
Section: Theoretical Formulation Shown Inmentioning
confidence: 99%
See 1 more Smart Citation
“…Consider now a sectorial plate domain having unit radius ( r ) , included angle ( a ) and polar co-ordinate origin at the reentrant corner of the skew plate shown in Figure 1 (12) Given that the power terms in r are non-zero, equation (1 1) reduces to which may be factored into…”
Section: Theoretical Formulation Shown Inmentioning
confidence: 99%
“…and F,(& A,) is now expressed as the general solution of the fourth-order differential equation (12), as follows:…”
Section: Theoretical Formulation Shown Inmentioning
confidence: 99%
“…In acidic slurry a high Cu/SiO 2 polish rate can be easily achieved. Hence, most of the copper CMP studies have focused on acidic slurries [6][7][8][9][10][11][12][13][14][15][16][17][18][19]. However, a disadvantage of the acidic slurries is the possible corrosion of the polishing equipment by the slurry [5].…”
Section: Introductionmentioning
confidence: 98%
“…Most of them propose chemical interaction between the ceria abrasive and the silicon dioxide surface [5,[7][8][9], while in situ frictional force measurements seem to indicate that the effect may be mainly mechanical [10]. Various additives have been used in ceria-based slurries to suppress the silicon nitride polish rate and maintain a high or moderate silicon dioxide polish rate, thus enhancing the selectivity [11][12][13]. The mechanism of action of these high selective slurries is not understood well.…”
Section: Introductionmentioning
confidence: 99%