2020
DOI: 10.1016/j.apsusc.2020.146747
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Freestanding GaN substrate enabled by dual-stack multilayer graphene via hydride vapor phase epitaxy

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Cited by 7 publications
(7 citation statements)
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“…During van der Waals epitaxy, nucleation density and crystalline alignment on the van der Waals surface are significantly suppressed due to the low surface free energy, leading to poor convergence or even failure in film formation. For example, directly growing GaAs or GaN on graphene tends to produce micro- and nanorods. The orientation of GaAs or GaN unit cells is observed not strictly aligned to that of graphene unit cells during the van der Waals epitaxy process due to the weak interactions. , In the reports that show GaN layer exfoliation, rough surface morphology and polycrystalline structure are often observed. Moreover, 2D materials are susceptible to damage due to the harsh ambient where crystalline semiconductor thin films are produced. Damaged 2D materials and the associated defective van der Waals surfaces can lead to failure in releasing the membranes.…”
mentioning
confidence: 99%
“…During van der Waals epitaxy, nucleation density and crystalline alignment on the van der Waals surface are significantly suppressed due to the low surface free energy, leading to poor convergence or even failure in film formation. For example, directly growing GaAs or GaN on graphene tends to produce micro- and nanorods. The orientation of GaAs or GaN unit cells is observed not strictly aligned to that of graphene unit cells during the van der Waals epitaxy process due to the weak interactions. , In the reports that show GaN layer exfoliation, rough surface morphology and polycrystalline structure are often observed. Moreover, 2D materials are susceptible to damage due to the harsh ambient where crystalline semiconductor thin films are produced. Damaged 2D materials and the associated defective van der Waals surfaces can lead to failure in releasing the membranes.…”
mentioning
confidence: 99%
“…Single crystalline GaN --2020 [43] sublimating the top Si surface and rearranging the remaining carbon atoms on the single-crystal SiC wafer. Mechanical spalling conducted using Ni as the stressor layer is mostly used for exfoliating epitaxial layers by using hard and atomically flat SiC wafers.…”
Section: Mrs -Copper Platementioning
confidence: 99%
“…In 2020, Su et al fabricated a self-separation freestanding GaN substrate through the dual-stack MLG. [43] Schematics of this process are shown in Figure 20a-j. To achieve a high-quality graphene layer, they pretreated a copper foil via acetic acidorganic cleaning-annealing.…”
Section: Transfer Of the Epitaxial Layer By Self-separationmentioning
confidence: 99%
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“…The critical step in this approach is the graphene layer transfer. Thicker graphene interlayers allow for easier exfoliation of the grown epilayer, since the separation of films tends to occur within graphene layers [ 3 , 16 ] due to weaker bindings between the graphene layers than that between the graphene and the GaN [ 17 , 18 ]. On the other hand, to ensure interaction between the substrate and the epilayer, the graphene interlayer thickness must not exceed two monolayers [ 1 , 9 , 11 ], which restrains the graphene layer to either monolayer or bilayer thickness.…”
Section: Introductionmentioning
confidence: 99%