The semiconductor industry continues to relentlessly advance silicon technology scaling into the deep-submicron (DSM) era. High integration levels and structured design methods enable complex systems that can be manufactured in high volume.However, due to increasing integration densities and high operating speeds, subtle manifestation of defects leads to functional failures at the board level. Functional fault diagnosis is, therefore, necessary for board-level product qualification. However, ambiguous diagnosis results can lead to long debug times and wrong repair actions, which significantly increase repair cost and adversely impact yield.