2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2016
DOI: 10.1109/ipfa.2016.7564318
|View full text |Cite
|
Sign up to set email alerts
|

From IC debug to hardware security risk: The power of backside access and optical interaction

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
9
0

Year Published

2018
2018
2023
2023

Publication Types

Select...
4
3
2

Relationship

0
9

Authors

Journals

citations
Cited by 28 publications
(9 citation statements)
references
References 11 publications
0
9
0
Order By: Relevance
“…Hence, novel protection mechanisms for the IC backside should be researched. One potential physical protection could be the utilization of different coating layers on the silicon substrate, which can reflect the incoming photons from a set of light sources to set of light detectors [15]. In this structure, to unblock the optical path from transistors, the coating layers must be removed from the silicon substrate.…”
Section: Discussionmentioning
confidence: 99%
“…Hence, novel protection mechanisms for the IC backside should be researched. One potential physical protection could be the utilization of different coating layers on the silicon substrate, which can reflect the incoming photons from a set of light sources to set of light detectors [15]. In this structure, to unblock the optical path from transistors, the coating layers must be removed from the silicon substrate.…”
Section: Discussionmentioning
confidence: 99%
“…4) Optical Resolution: The optical resolution of laserassisted side-channel techniques has been discussed extensively by the research community in numerous publications, e.g., in [4], [21], [45]- [48]. Nonetheless, we discuss the most important and new insights in the following.…”
Section: B Applicability Of Llsimentioning
confidence: 99%
“…Due to the increasing number of metal layers on the frontside of integrated circuits (ICs), optical FA techniques have been developed to access on-chip signals through the backside [40]. The main techniques are photon emission analysis, laser stimulation, and optical probing, which take advantage of the high infrared transmission of silicon for wavelengths above 1 µm.…”
Section: B Optical Backside Failure Analysis Techniquesmentioning
confidence: 99%