Full color LED display panel fabricated on a silicon microreflector

Takahashi, K.; Nakajima, Shin; Takeuchi, Susumu

doi:10.1109/memsys.1997.581854

Cited by 5 publications

(2 citation statements)

References 2 publications

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“…Light-emitting diode (LED) displays (1)(2)(3)(4)(5) are transforming the landscape of display technology for higher dynamic range, improved readability under various illumination conditions, and unprecedented form factors applicable to surface-mountable electronics (6,7), biomedical devices (8,9), and transportation vehicles. The application-driven development of LEDs requires achieving high-performance and costeffective manufacturing.…”

Section: Introductionmentioning

confidence: 99%

Remote heteroepitaxy of GaN microrod heterostructures for deformable light-emitting diodes and wafer recycle

et al. 2020

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There have been rapidly increasing demands for flexible lighting apparatus, and micrometer-scale light-emitting diodes (LEDs) are regarded as one of the promising lighting sources for deformable device applications. Herein, we demonstrate a method of creating a deformable LED, based on remote heteroepitaxy of GaN microrod (MR) p-n junction arrays on c-Al2O3 wafer across graphene. The use of graphene allows the transfer of MR LED arrays onto a copper plate, and spatially separate MR arrays offer ideal device geometry suitable for deformable LED in various shapes without serious device performance degradation. Moreover, remote heteroepitaxy also allows the wafer to be reused, allowing reproducible production of MR LEDs using a single substrate without noticeable device degradation. The remote heteroepitaxial relation is determined by high-resolution scanning transmission electron microscopy, and the density functional theory simulations clarify how the remote heteroepitaxy is made possible through graphene.

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Section: Introductionmentioning

confidence: 99%

Remote heteroepitaxy of GaN microrod heterostructures for deformable light-emitting diodes and wafer recycle

et al. 2020

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“…LED display is a kind of display screen composed of LED array device and used to display text, graphics and text and other information, and television, a video signal by a certain control method [1,2] . LED display has a wide range of types and can be used in many occasions.…”

Section: Introductionmentioning

confidence: 99%

Full-color LED display research based on chip on board(COB) package

2014

2014 15th International Conference on Electronic Packaging Technology

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LED display industry has entered an integrated period with the characteristics of more mature technology of every aspect and higher demand for the quality of LED display. LED display are developing in the direction of the high resolution, high density, small pixel pitch, intelligent. So the demand for the LED display screen manufacturing technology, especially the LED display module package is higher and higher, the pixel pitch of current LED display are below 2.5 mm(P2.5), some can reach P2, P1.5, P1.0 and even less. However, the current LED display with high definition and small pixel pitch used reflow soldering to mount surface mounted device three-in-one onto the printed circuit board. It's mature and widely used to manufacture LED display by this way, but there are many problems by using these discrete LED components to manufacture the LED display of high density, such as the poor reliability, the bad yield and the heat dissipation problem. Described in this paper, a new integrated packaging method called COB package--mounting the LED chips directly to the module substrate, and then doing the whole molding, will reduce the process and manufacturing cost greatly, improve the reliability and show better picture quality. COB packaging method will be a trend of LED display package in the future.

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Investigation of the influence of Ag reflective layer on the Correlated Color Temperature and the Angular Color Uniformity of LED with conformal phosphor coating

Tain

Lee

et al. 2015

2015 16th International Conference on Electronic Packaging Technology (ICEPT)

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Full color LED display panel fabricated on a silicon microreflector

Cited by 5 publications

References 2 publications

Remote heteroepitaxy of GaN microrod heterostructures for deformable light-emitting diodes and wafer recycle

Remote heteroepitaxy of GaN microrod heterostructures for deformable light-emitting diodes and wafer recycle

Full-color LED display research based on chip on board(COB) package

Investigation of the influence of Ag reflective layer on the Correlated Color Temperature and the Angular Color Uniformity of LED with conformal phosphor coating

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