2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2011
DOI: 10.1109/impact.2011.6117181
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Full wafer level stacking without TSV applications to memory-only and heterogeneous SiP

Abstract: A technological break based on Wafer Level Package started in 2002; consists in only stacking Known Good Rebuilt Wafer (what Freescale named: RCP and Infineon named eWlb) instead of standard wafers. This approach allows to have a very good yield, on the contrary of the W2W with TSV technologies. Several applications will be presented on the medical area, industrial area and smart card area.

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