Full wave analysis of propagation characteristics of a through hole using the finite-difference time-domain method

Maeda, Shuji; Kashiwa, Tatsuya; Fukai, Ichiro

doi:10.1109/22.106558

Cited by 119 publications

(10 citation statements)

References 8 publications

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“…Then some full-wave computational electromagnetic methods have been applied to the analysis for the propagation characteristics of via structures such as the finite-difference timedomain method [6] and the MOM [7]. Specially, the analysis of MOM needs to obtain help from the matrix-penciled method to extract the extreme value of current distribution, so this method also can be called the matrix-penciled moment method (MP-MOM).…”

Section: Introductionmentioning

confidence: 99%

Novel hybrid analysis method for via structure in microwave multilayer circuits

Tian

Tong

2011

Int J Numerical Modelling

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SUMMARYA novel hybrid analysis method including physical modeling approach is presented for the single complete via structure in this paper. The via structure can be decomposed into two types of different sub-structures: the interior structure and the exterior structure. The characteristic of the interior structure consisting of the vertical via hole between reference planes is solved using the enhanced quasi-static method which takes into account the effect of parallel plates. The characteristic of the exterior structure is solved by the improved matrix-penciled fent method.Then the scattering parameters of the complete via structure can be obtained from the result of the exterior and the interior structure. In order to validate the correctness and the accuracy, the comparison results between the hybrid method and Ansoft's HFSS software are displayed for some microwave multilayer circuits with different layer numbers and different boundary conditions.

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Section: Introductionmentioning

confidence: 99%

Novel hybrid analysis method for via structure in microwave multilayer circuits

Tian

Tong

2011

Int J Numerical Modelling

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“…The FDTD method was used in Ref. to in the analysis of the electromagnetic characteristics of a through‐hole. Despite its versatility, the FDTD method is numerically intensive and has a relatively lower accuracy than the frequency‐domain methods.…”

Section: Introductionmentioning

confidence: 99%

Circuit model and signal integrity analysis for multilayer printed circuit board interconnection

Kong

Sheng

et al. 2013

Int J RF and Microwave Comp Aid Eng

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A circuit modeling method and signal integrity analysis approach for multilayer printed circuit board interconnection based on the partial equivalent element circuit (PEEC) method is proposed. The multilayer interconnection structure is divided into a via hole and microstrip lines. A three-dimensional (3D) model of a via hole structure is constructed using the PEEC method with Rao-Wilton-Glisson (RWG) basis functions. The microstrip lines on the top and bottom layers are modeled by PEEC method with RWG basis functions and discrete complex image. The model order reduction method is used to analyze effectively the via hole structure. The equivalent circuit of the via hole structure is simplified, and its physical meaning is defined. The scattering (S) parameter obtained from the proposed method is consistent with simulation results, which are computed using the commercial 3D electromagnetic field analysis software FEKO. The correctness of the proposed method is validated. The S parameters of different dimensions are simulated, and the effects of these dimensions on the electromagnetic characteristics of the via hole structure are analyzed. The model of the entire structure is used to conduct eye diagram simulation.

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“…IM circuit elements [2], [3], and scatterers for which electromagnetic analysis is desired contain metal boundaries which can not all be made parallel to a set of Cartesian or other cxthogonal coordinate axes. Whereas the standard Finite Diffxence time Domain (FDTD) technique is well proven as a n efficient method of analyzing structures whose boundaries are all parallel to the coordinate axes, the accuracy and efficiency deteriorates if the structure under investigation contains boundaries at arbitrary angles.…”

Section: Introduction Any Structures Such As Printed Antennas [L]mentioning

confidence: 99%

“…Whereas the standard Finite Diffxence time Domain (FDTD) technique is well proven as a n efficient method of analyzing structures whose boundaries are all parallel to the coordinate axes, the accuracy and efficiency deteriorates if the structure under investigation contains boundaries at arbitrary angles. Several methods have tleen proposed in the literature to overcome this problem, the >implest being to resort to the use of a very fine mesh [2]. .…”

Section: Introduction Any Structures Such As Printed Antennas [L]mentioning

confidence: 99%

An algorithm for the treatment of curved metallic laminas in the finite difference time domain method

Railton

1993

IEEE Trans. Microwave Theory Techn.

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General rightsThis document is made available in accordance with publisher policies. Please cite only the published version using the reference above. Full terms of use are available: http://www.bristol.ac.uk/pure/about/ebr-terms Techniques designed to overcome this problem such as locally or globally deformed grids, or the use of nonorthogonal coordinate systems have been reported but these impose a penalty in computa tional effort or in flexibility. In this contribution, an alternative te8:hnique is described whereby the standard Cartesian grid is maintained, and the existence of the material boundaries is accounted for by the use of special finite difference equations for the affected nodes. These equations take account not only of the position of the boundaries but also of the asymptotic field bchavior in their vicinity. This technique results in a flexible, a(atrate, and efficient, implementation which is applicable to a vide range of MMIC and antenna structures.

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Full wave analysis of propagation characteristics of a through hole using the finite-difference time-domain method

Cited by 119 publications

References 8 publications

Novel hybrid analysis method for via structure in microwave multilayer circuits

Novel hybrid analysis method for via structure in microwave multilayer circuits

Circuit model and signal integrity analysis for multilayer printed circuit board interconnection

An algorithm for the treatment of curved metallic laminas in the finite difference time domain method

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