2010
DOI: 10.1016/j.mee.2009.11.098
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Fully automated hot embossing processes utilizing high resolution working stamps

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Cited by 14 publications
(4 citation statements)
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“…We fabricated a mold consisting of the PR chambers, channel, and frits and a mold for the substrate containing alignment grooves for the input/output glass capillaries on Si wafers. The SU-8 molds were then transferred to a soft polymeric mold (MD700 working stamps, Solvay) via an intermediate PDMS transfer mold. PDMS replicas of the SU-8 are fabricated as described by others: PDMS and curing agent (Sylgard 184, Dow Corning) were mixed in a 10:1 mass ratio, poured onto the SU-8 mold, degassed, and cured at 80 °C for 2 h. The working stamp mold was fabricated by applying MD700 polymer onto the PDMS mold with a photocurable agent and exposed to UV light (40 mJ, 15 min).…”
Section: Methodsmentioning
confidence: 99%
“…We fabricated a mold consisting of the PR chambers, channel, and frits and a mold for the substrate containing alignment grooves for the input/output glass capillaries on Si wafers. The SU-8 molds were then transferred to a soft polymeric mold (MD700 working stamps, Solvay) via an intermediate PDMS transfer mold. PDMS replicas of the SU-8 are fabricated as described by others: PDMS and curing agent (Sylgard 184, Dow Corning) were mixed in a 10:1 mass ratio, poured onto the SU-8 mold, degassed, and cured at 80 °C for 2 h. The working stamp mold was fabricated by applying MD700 polymer onto the PDMS mold with a photocurable agent and exposed to UV light (40 mJ, 15 min).…”
Section: Methodsmentioning
confidence: 99%
“…The mold can consist of different materials, such as silicon or nickel coated metals, and substrate material variants can be a variety of polymers and even glass 55. Depending on the substrate material used, and the hot embossing technique, the resolution can be as precise as 50 nm 57. Hot embossing offers an easy and inexpensive method for production, with high throughput and high accuracy 55.…”
Section: Materials and Manufacturing Methodsmentioning
confidence: 99%
“…The use here of fluorinated polymer working stamp facilitates the demolding process after hot embossing. The working stamp was created by pouring liquid precursor of UV-curable polymer (MD700) mixed with 1% photoinitiator (Darocur ® 1173) onto the Si master [ 32 ] following with flood lamp UV curing at room temperature (Dymax ECE 2000 UV, Torrington, CT, 2 min). The working stamp was used to hot emboss COC substrates (Zeonor 1060 R) under vacuum at 10 kN and 140 °C for 10 min.…”
Section: Methodsmentioning
confidence: 99%