Articles you may be interested inLarge-diameter roll mold fabrication method using a small-diameter quartz roll mold and UV nanoimprint lithography J. Vac. Sci. Technol. B 29, 06FC08 (2011); 10.1116/1.3657524Fabrication of three dimensional structures for an UV curable nanoimprint lithography mold using variable dose control with critical-energy electron beam exposure Extreme ultraviolet lithography based nanofabrication using a bilevel photoresistThe resolution, dimension stability, and reproducibility of the Soft UV-Nanoimprint is investigated. The potential for imprinting nanostructures with flexible molds in UV-curable resists in the 100 nm regime are explored and the limitations analyzed. The dimensional stability of imprinted patterns is determined by the deformation of the mold that in term depends on the geometry of the structures and the imprint pressure applied.

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Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). The main advantages of this method are: surface planarization, encapsulation of structures on the wafer surface, particle compensation and decrease of annealing temperature after bonding. This paper presents results on adhesive bonding using spin-on glass and Benzocyclobutene (BCB) from Dow Chemicals. The advantages of using adhesive bonding for MEMS applications will be illustrated by presenting a technology of fabricating GaAs-on-Si substrates (up to 150 mm diameter) and results on BCB bonding of Si wafers (200 mm diameter).