2015 IEEE International Electron Devices Meeting (IEDM) 2015
DOI: 10.1109/iedm.2015.7409770
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Fully functional perpendicular STT-MRAM macro embedded in 40 nm logic for energy-efficient IOT applications

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Cited by 42 publications
(19 citation statements)
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“…Pipelining, however, requires complex circuitry. Logic in-memory architecture [35,36] In-memory logic for big-data applications Mitigates the bottleneck in data exchange between logic and memory Dual edge clocking [37] Reduces the clock frequency to half of the single edge-triggered flip-flops…”
Section: Gate Sizingmentioning
confidence: 99%
“…Pipelining, however, requires complex circuitry. Logic in-memory architecture [35,36] In-memory logic for big-data applications Mitigates the bottleneck in data exchange between logic and memory Dual edge clocking [37] Reduces the clock frequency to half of the single edge-triggered flip-flops…”
Section: Gate Sizingmentioning
confidence: 99%
“…Since these technologies are quite young and require further development, they are not considered in this work. On the contrary, several prototypes demonstrated the maturity of the STT-MRAM technology ( [7], [8], [9], [10]). …”
Section: Introductionmentioning
confidence: 99%
“…Resistive memories [1], [2] are a class of non-volatile embedded memories that have the potential to be a universal memory technology by providing the density of DRAM, the speed of SRAM and the non-volatility of Flash. Resistive memories typically consist of a 1T-1R structure [3], [4], with a resistive storage device (e.g.…”
Section: Introductionmentioning
confidence: 99%