Fully integrated hybrid microwave photonic receiver

Abstract

Microwave photonic receivers are a promising candidate in breaking the bandwidth limitation of traditional radio-frequency (RF) receivers. To further balance the performance superiority with the requirements regarding size, weight, and power consumption (SWaP), the implementation of integrated microwave photonic microsystems has been considered an upgrade path. However, up to now, to the best of our knowledge, chip-scale fully integrated microwave photonic receivers have not been reported due to the limitation of material platforms. In this paper, we report a fully integrated hybrid microwave photonic receiver (FIH-MWPR) obtained by comprising the indium phosphide (InP) laser chip and the monolithic silicon-on-insulator (SOI) photonic circuit into the same substrate based on the low-coupling-loss micro-optics method. Benefiting from the integration of all optoelectronic components, the packaged FIH-MWPR exhibits a compact volume of 6 cm 3 and low power consumption of 1.2 W. The FIH-MWPR supports a wide operation bandwidth from 2 to 18 GHz. Furthermore, its RF-link performance to down-convert the RF signals to the intermediate frequency is experimentally characterized by measuring the link gain, the noise figure, and the spurious-free dynamic range metrics across the whole operation frequency band. Moreover, we have utilized it as a de-chirp receiver to process the broadband linear frequency-modulated (LFM) radar echo signals at different frequency bands (S-, C-, X-, and Ku-bands) and successfully demonstrated its high-resolution-ranging capability. To the best of our knowledge, this is the first realization of a chip-scale broadband fully integrated microwave photonic receiver, which is expected to be an important step in demonstrating the feasibility of all-integrated microwave photonic microsystems oriented to miniaturized application scenarios.

Multiband Signal Receiver by Using an Optical Bandpass Filter Integrated with a Photodetector on a Chip

“…By virtue of the rapid development of high-speed and high-power photodetectors on silicon photonics platforms, the high-frequency signals of the K-band, Ka-band and even broader bands can be received [ 30 , 31 , 32 , 33 , 34 , 35 ]. Last, but not least, the laser sources and phase modulators could be integrated with the OBPF and PD by advanced hybrid integration technology to realize the complete integration of MWP receiving systems [ 36 , 37 ].…”

Silicon photonics enabled universal cross-scale tensor processing on chip

“…However, as a prototype, the energy e ciency of the entire computing system implemented by the SiP-CSTP chip is expected to be further improved. This can be achieved through the adoption of heterogeneous integration of III-V lasers 12 and MRR optical frequency comb light sources [40][41][42] , as well as on-chip semiconductor optical ampli ers (SOAs) or erbium-doped circuit-based ampli ers replacing EDFAs 39,43 . Thus, the expected power consumption is evaluated as 952.24 mW at the scale of in our SiP-CSTP system.…”

“…Silicon photonics offers an attractive platform for realizing integrated photonic computing with photonicelectronic fusion characteristics 6,7 . It enables scalable and cost-effective integration of various functional optoelectronic devices, including lasers, modulators, photodetectors, and passive interferometers [8][9][10][11][12] .…”

Multi-functional microwave photonic circuit based on thin film lithium niobate platform

“…The spurious-free dynamic range (SFDR) is calculated by OIP3 and noise floor, that is SFDR = 2/3 × (OIP3[dBm]-N[dBm/Hz]) = 105.4dB/Hz 2/3 . Benefiting from the linear electro-optical response of the Pockels effect, the chip shows better performance compared with silicon photonic, which usually achieves SFDR at a level below 100dB/Hz 2/3 [3,4] The characterization of the self-interference cancellation processing is shown in Fig. 6(a).…”

“…Integrated microwave photonic circuits are drawn great attention in recent years to implement the promise of broad bandwidth, flexibility made by microwave photonics, overcoming the obstacles of size, weight, and sensitivity to external disturbance [1] . Several microsystems, such as frequency doubler [2] , mixer [3,4] , self-interference canceller [5] and programmable processor [6,7] have been designed or demonstrated on silicon photonic, indium phosphide and hybrid platforms. Although the integrated programmable processors have demonstrated the reconfigurability of microwave photonics, these efforts focus on the passive signal processing such as filtering, linear transformation and wavelength division multiplexing.…”