2011
DOI: 10.1063/1.3624831
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Functional electroless gold Ohmic contacts in light emitting diodes

Abstract: Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p-and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated an… Show more

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Cited by 4 publications
(2 citation statements)
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“…Although conventional EP leads to the formation of metal islands, which at later stages merge to dense deposits, 32,42 we find evolution of separate nanostructures. With ongoing Au deposition, 1D growth begins to dominate and NWs emanate from the particles comprising the initial film (Figure 2b).…”
Section: Resultsmentioning
confidence: 68%
“…Although conventional EP leads to the formation of metal islands, which at later stages merge to dense deposits, 32,42 we find evolution of separate nanostructures. With ongoing Au deposition, 1D growth begins to dominate and NWs emanate from the particles comprising the initial film (Figure 2b).…”
Section: Resultsmentioning
confidence: 68%
“…Conducting electroless gold pads on light-emitting diodes chips are fabricated which exhibit no color difference, reliable wire bonding ability, and high values of electrical conductivity. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauges [37]. The industrial application of this plating is feasible.…”
Section: Nanoscaled Films and Layersmentioning
confidence: 85%