Fundamentals of Electromigration

Lienig, Jens; Thiele, Maik

doi:10.1007/978-3-319-73558-0_2

Cited by 18 publications

(13 citation statements)

References 40 publications

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“…This can be easily understood by looking at the activation energies for the different kinds of diffusion in aluminium; bulk diffusion had an activation energy of 1.2 eV whilst surface diffusion was 0.8 eV. On the other hand, grain boundary diffusion had an activation energy of 0.7 eV, which meant that this diffusion path was the most favourable energetically speaking [22].…”

Section: Cnt As High Ampacity Materialsmentioning

confidence: 99%

“…Soon, copper was found to be a good replacement for aluminium, both by doping aluminium with copper, and by using pure copper as the line material. Copper, in comparison to aluminium has different diffusion activation energies—bulk, grain-boundary and surface diffusion were in the order of highest to lowest activation energies, making surface diffusion the preferred mechanism in copper (2.3, 1.2 and 0.8 eV, respectively) [22]. However, copper in contact with air rapidly oxidizes, which prevents diffusion through the surface, and therefore grain boundary becomes the primary diffusion pathway.…”

Section: Cnt As High Ampacity Materialsmentioning

confidence: 99%

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High Ampacity Carbon Nanotube Materials

et al. 2019

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Constant evolution of technology is leading to the improvement of electronical devices. Smaller, lighter, faster, are but a few of the properties that have been constantly improved, but these developments come hand in hand with negative downsides. In the case of miniaturization, this shortcoming is found in the inherent property of conducting materials—the limit of current density they can withstand before failure. This property, known as ampacity, is close to reaching its limits at the current scales of use, and the performances of some conductors such as gold or copper suffer severely from it. The need to find alternative conductors with higher ampacity is, therefore, an urgent need, but at the same time, one which requires simultaneous search for decreased density if it is to succeed in an ever-growing electronical world. The uses of these carbon nanotube-based materials, from airplane lightning strike protection systems to the microchip industry, will be evaluated, failure mechanisms at maximum current densities explained, limitations and difficulties in ampacity measurements with different size ranges evaluated, and future lines of research suggested. This review will therefore provide an in-depth view of the rare properties that make carbon nanotubes and their hybrids unique.

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Section: Cnt As High Ampacity Materialsmentioning

confidence: 99%

Section: Cnt As High Ampacity Materialsmentioning

confidence: 99%

High Ampacity Carbon Nanotube Materials

et al. 2019

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“…Nevertheless, a current stressing is still an appropriate electromigration testing method for many studies which provide useful information on the failure mechanism of electromigration. 21,38,39 Assuming that a current is applied to a testing line, the MTTF, as mentioned by averaging the data from at least five respective testing samples, can be analogously obtained when the void reaches a critical volume while neglecting the time required to nucleate the void. As known the MTTF is defined as the critical volume of the formed void divided by the product of the cross-sectional area of interface diffusion and diffusion rate under the electrical stressing as follows: [40][41][42]…”

Section: Resultsmentioning

confidence: 99%

“…Electromigration causes atom transportation in the direction of the electron motion. Because the transportation paths are materialand size-dependent, 39 a material has three diffusion paths, including (a) bulk diffusion (within the grain), (b) grain-boundary diffusion, and (c) surface diffusion. From the cross-sectional image (Fig.…”

Section: The Cu Linementioning

confidence: 99%

Strengthening the Electromigration Resistance of Nanoscaled Copper Lines by (3-aminopropyl)trimethoxysilane Self-Assembled Monolayer

Fang

Lee

Cheng

et al. 2021

ECS J. Solid State Sci. Technol.

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A nanoscaled copper (Cu) line is subject to aggravated electromigration after prolonged use, and thus the use of ultrathin barrier/ capping layer without degrading its electrical properties is increasingly needed. The aim of this study is to investigate the electromigration resistance of Cu interconnect strengthened by a self-assembled monolayer of (3-aminopropyl)trimethoxysilane (APTMS-SAM) and to develop an entirely wet chemically process for the fabrication of Cu lines. The Cu line with its bottom and sidewalls coated by an APTMS-SAM remains intact and yields the lowest resistivity of 1.80 μΩ-cm even after 500 °C annealing. The resistance of the Cu line against electromigration is remarkedly strengthened by using the APTMS-SAM as a molecular thick barrier due to a low relative diffusion rate of atoms under a constant current stressing, leading to an enhancement of thermal stability by at least 100 °C. The depletion of Cu atoms of a bare Cu line is observed to start from its top area, suggesting surface diffusion is the dominating electromigration mechanism. The enhancement of the Cu interconnect encapsulated by an APTMS-SAM is thus proposed, which indeed serves as a barrier to strengthen the electromigration resistance and enhance the thermal stability of the nanoscaled Cu line.

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“… Safety: Flexible cables have the possibility of leaking current into the human body when they have deteriorated or have become damaged. By using an alternating current (AC) power supply, the ion migration phenomenon [20] is reduced, which is the main cause of cable deterioration. Further, coupling capacitors at the input/output section of the power supply wiring separate the grounds of the implantable control unit and the stimulation unit. Minimal invasiveness: Because the stimulation electrode unit is implanted in the eyeball, it must be as small as possible; thus, the CMOS chips in the module should have minimal components. Low power consumption: There is a limit to the power that can be supplied to devices completely implanted in the human body because of the small acceptable heat generation. …”

Section: Introductionmentioning

confidence: 99%

AC power supply circuit architecture for a miniaturised retinal prosthesis device

Mori

Chang

Endo

et al. 2021

J. eng.

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This study proposes an alternating current (AC)‐driven retinal prosthesis device using an implantable CMOS‐LSI chip that can control multiple electrodes. The proposed device uses AC power with the electrical grounds of the main and stimulation units separated to reduce the possibility of current leakage and to improve safety. The stimulation unit implanted in the eye cannot include large capacitor chips for ground separation. To solve this problem, large capacitor chips are mounted on the implantable control unit that supplies power, not on the stimulating device, and a cooperative mode of operation is devised. In this way, it is realised that a circuit configuration that achieves both miniaturisation and improved power supply efficiency. This study verifies the functionality of the proposed circuit. The results suggest that power supply and stimulation operations are possible through coupling capacitors. In addition, this stimulation operation can be performed continuously.

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Fundamentals of Electromigration

Cited by 18 publications

References 40 publications

High Ampacity Carbon Nanotube Materials

High Ampacity Carbon Nanotube Materials

Strengthening the Electromigration Resistance of Nanoscaled Copper Lines by (3-aminopropyl)trimethoxysilane Self-Assembled Monolayer

AC power supply circuit architecture for a miniaturised retinal prosthesis device

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