Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages

Lee, Sangil

doi:10.1007/978-3-319-44586-1_7

Cited by 8 publications

(2 citation statements)

References 16 publications

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“…9Ø…ÜTCB£Thermal Compress Bonding¤Eâ [47] ?18¤,duTCB 8¤ ë‚måˆ 10∼1um, ykPCB8¤ë‚må•500um,TCB 8¤pë-ÝOEJ,2500∼250000 ,Ø =OE {'ÖµCó²ƒ'› §ó² î-á , …OE±U,8¤ØÓáŸ!ØÓì ‡!ØÓ( â,)˜Ôn8¤ m˜5.…”

Section: Lsoc Sdsowmentioning

confidence: 99%

从SoC到SDSoW：微电子发展的新范式

Wu,

Liu,

Shen

et al. 2024

Sci. Sin.-Inf.

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Section: Lsoc Sdsowmentioning

confidence: 99%

从SoC到SDSoW：微电子发展的新范式

Wu,

Liu,

Shen

et al. 2024

Sci. Sin.-Inf.

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“…The increasing requirements of vacuum packaging have driven the research for robust and high vacuum packaging techniques of MEMS devices. Many technologies have been proposed to satisfy this goal, such as anodic bonding [3,4], eutectic bonding [5,6], glass frit bonding [7,8], laser welding [9], thermal compression bonding [10,11] and polymer bonding [12,13]. In our case, the physics package of a chip-scale atomic clock (CSAC) is an optoelectronic system that consists of heterogeneous discrete components such as a vertical cavity surface emitting laser (VCSEL), photodiode (PD), attenuator, MEMS 87 Rb cell and 795 nm quarter-wave plate (QWP).…”

Section: Introductionmentioning

confidence: 99%

High Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components

Guo

Meng²,

Dan

et al. 2021

Applied Sciences

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Vacuum packaging of Micro-electro-mechanical system (MEMS) devices is a hot topic for its advantages of improving performance and reducing power consumption. In this paper, the physics package of a chip scale atomic clock (CSAC), as a typical kind of MEMS device, is performed by vacuum packaging based on a systematic method proposed by us. The whole process, including low outgassing and thermal stable materials selection, prebaking for desorption, getter firing for absorption and solder reflow for vacuum sealing is introduced thoroughly. The thermogravimetric analysis or thermal gravimetric analysis (TGA) is used to analyze the thermal stability and desorption of materials. The leak rate of physics packages is measured to be less than 4 × 10−10 Pa·m3/s by helium leak detection. The residual gas pressure and composition in physics packages are analyzed after vacuum packaging. The results show a high vacuum ~0.1 Pa in the physics package. The frequency stability is improved from 4.68 × 10−11 to 1.07 × 10−11 @40,000 s. The presented method for high vacuum packaging is also applicable to other MEMS devices.

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