2020 IEEE International Reliability Physics Symposium (IRPS) 2020
DOI: 10.1109/irps45951.2020.9128224
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Further Investigation on Mechanism of Trap Level Modulation in Silicon Nitride Films by Fluorine Incorporation

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Cited by 4 publications
(3 citation statements)
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“…In the same way, fluorine atoms in the SiN film also make the trap energy hole trap level shallower. [22][23][24][25] On the other hand, it has been reported that the hydrogen in SiO 2 films, which exists as hydrogen bridges and hydroxyl E' centers, can be eliminated through hydrogen remote plasma treatment. 26) For instance, hydrogen can be removed through the reaction of Si H H Si H 2 ⟶ • º -+ º + * by providing atomic hydrogen.…”
Section: Resultsmentioning
confidence: 99%
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“…In the same way, fluorine atoms in the SiN film also make the trap energy hole trap level shallower. [22][23][24][25] On the other hand, it has been reported that the hydrogen in SiO 2 films, which exists as hydrogen bridges and hydroxyl E' centers, can be eliminated through hydrogen remote plasma treatment. 26) For instance, hydrogen can be removed through the reaction of Si H H Si H 2 ⟶ • º -+ º + * by providing atomic hydrogen.…”
Section: Resultsmentioning
confidence: 99%
“…The estimated energy level of the trap is less than 1 eV. 23,24) On the other hand, it has been reported that the hydrogen in SiO 2 films can be eliminated by the hydrogen remote plasma process. 25) The interfacial layers of SiO 2 in high-k/metal gate stacks are ultra-thin and contain hydrogen, including hydrogen bridges and hydroxyl E' centers.…”
Section: Introductionmentioning
confidence: 99%
“…3,4) Its electrical properties are known to be sensitive to changes in elemental composition and material structure during the manufacturing process. [5][6][7][8][9] Correlations between electrical properties and electronic structures 10,11) have been studied in detail by means of electrical 12,13) and optical measurements. [13][14][15][16] On the other hand, nanoscale spatial resolution is required to investigate the local physical properties and their spatial distributions over the entire structures of devices.…”
mentioning
confidence: 99%