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The energy level of electron traps in silicon nitride (SiN x ) thin films was investigated by discharging current transient spectroscopy (DCTS). Results indicate that the trap level of the SiN x thin films becomes deeper with decreasing composition (N/Si) and shallower after hydrogen annealing. The dependence of the trap level on the SiN x composition and the modulation of the trap level by hydrogen annealing are possibly related to the change in the number of Si-H bonds in the SiN x thin films.

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Discharge current transient spectroscopy (DCTS) is a promising technique for detecting the trap level and density in dielectrics because it is based on a simple emission process. In order to confirm the validity of DCTS, we compare the results from the conventional deep-level transient spectroscopy (DLTS) technique for samples of CVD-grown silicon nitride (SiNx) films. Results indicated that a trap level, about 0.6 eV below the energy level of the conduction band edge in the SiNx thin films estimated by DCTS is in good agreement with that obtained from DLTS analysis, and it is found that the trap density increases with the decreasing N/Si ratio in the SiNx film. As a proposed estimation for energy level in defects, it will be originated from hydrogen-incorporated defects in the SiNx matrix. This study demonstrates that the DCTS method will be a useful electrical method for the evaluation of defects.

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