1984 International Electron Devices Meeting 1984
DOI: 10.1109/iedm.1984.190721
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GaAs/AlGaAs double heterostructure high electron mobility transistors

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Cited by 14 publications
(4 citation statements)
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“…Ideally, the buffer layer should be as thin as possible so that isolation, by device processing compatible mesa etching, can be effected down to the SI substrate. This may be best accomplished by inclusion of a few period superlattice structures which would also minimize propagation of impurities and defects from the GaAs substrate [4]- [6] and reduce the minimum thickness requirements of the high purity buffer layer. In the case of planar processing, ion-implantation isolation, carried out prior to deposition of gate and first-level interconnect metallization, may be more effective for reducing backgate leakage current.…”
Section: Discussionmentioning
confidence: 99%
“…Ideally, the buffer layer should be as thin as possible so that isolation, by device processing compatible mesa etching, can be effected down to the SI substrate. This may be best accomplished by inclusion of a few period superlattice structures which would also minimize propagation of impurities and defects from the GaAs substrate [4]- [6] and reduce the minimum thickness requirements of the high purity buffer layer. In the case of planar processing, ion-implantation isolation, carried out prior to deposition of gate and first-level interconnect metallization, may be more effective for reducing backgate leakage current.…”
Section: Discussionmentioning
confidence: 99%
“… 17 The band gap is direct up to 1.98 eV, which corresponds to an Al content of ∼45%. 17 Therefore, the planar GaAs/AlGaAs material system has led to a wide range of applications over the past few decades, including high-electron-mobility transistors, 18 quantum well (QW) infrared detectors, 19 and near-infrared laser diodes. 20 …”
Section: Introductionmentioning
confidence: 99%
“…17 The band gap is direct up to 1.98 eV, which corresponds to an Al content of ∼45%. 17 decades, including high-electron-mobility transistors, 18 quantum well (QW) infrared detectors, 19 and near-infrared laser diodes. 20 AlGaAs has been successfully incorporated in GaAs NWs for a range of structures, using different growth techniques.…”
Section: ■ Introductionmentioning
confidence: 99%
“…This is because the two-dimensionally quantized electron gas (2DEG) at the hetero-interface exhibits very high mobility due to separation from the ionized impurity atoms. To further improve device performance using the highmobility characteristics of modulation-doped heterojunction structures, much attention has been paid to doubleheterojunction FET's (DHFET's) [3], [4] owing to recent progress in heterojunction device fabrication technology. The double-heterojunction structure (DH) provides twice the carrier density N, as SH.…”
Section: Introductionmentioning
confidence: 99%