GaAs E Band Radio Chip-Set

Tarazi, Jabra; Rodriguez, Melissa C.; Dadello, A.; McCulloch, MacCrae G.; Fattorini, Anthony P.; Hwang, Steve; Clement, Ryan; Parker, Anthony E.; Mahon, Simon J.

doi:10.1109/csics.2013.6659228

Cited by 3 publications

(1 citation statement)

References 13 publications

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“…The most compact solution to E-band transceivers is to market them as full systems-on-chip (SoC), as has been demonstrated in 100nm GaAs [18][19][20] [25] technologies. Though compact and efficient, the non-recurring cost associated with SoC does not make it a feasible option for low volume production or in development environments with limited prototyping resources.…”

Section: Approachesmentioning

confidence: 99%

A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers

Stander

2015

Africon 2015

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Abstract-With an ever increasing number of broadband applications in sub-Saharan Africa, mm-wave point-to-point networking has the potential to fill a niche in communications network architectures. Widespread adoption of this technology would benefit from conventional RF soft substrate integration and packaging, as opposed to system-on-chip or thick film processes. A review on the state-of-the-art in E-band soft substrate systems reveals significant reliance on MMICs. We propose that hybrid integration of active devices with off-chip passives, as well as better integration of active components in SIW, will lead to better performing E-band systems in soft substrates. Specific enabling techniques from the microwave domain are identified.

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