Gamma spectroscopic measurements using the PID350 pixelated CdTe radiation detector

Karafasoulis, K.; Zachariadou, K.; Seferlis, S.; Papadakis, I. E.; Loukas, D.; Lambropoulos, C.; Potiriadis, C.

doi:10.1109/nssmic.2010.5874526

Cited by 5 publications

(4 citation statements)

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“…Among other things, hardware investments seek a greater number, fill factor, density, and dynamic range of rapidly thermalising absorber “pixels” at low temperature, and high bandwidth low noise instrumentation through which to accurately measure and analyse signals. This will aid ultrafast energy-resolving polychromatic S(Q,ω) measurements where spectral resolution and higher detector stopping power is increasingly desirable in what are otherwise direct CCD 107 and higher-Z semiconductor arrays 189 . (For broadband ultrafast work where photons are valuable at the same time that some pileup is inevitable and potentially still useful, systems obviously must avoid the frustration of front end digital discriminator circuits 190,191 …”

Section: The Current State Of Playmentioning

confidence: 99%

Beating Darwin-Bragg losses in lab-based ultrafast x-ray experiments

Fullagar

Uhlig

Mandal

et al. 2017

Structural Dynamics

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Section: The Current State Of Playmentioning

confidence: 99%

Beating Darwin-Bragg losses in lab-based ultrafast x-ray experiments

Fullagar

Uhlig

Mandal

et al. 2017

Structural Dynamics

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“…The PID 350 CdTe detector (Ajat Oy Ltd., Finland) [10] shown in figure 1 was designed using GATE simulation. The detector was composed of eight 11.2 × 22.4 mm 2 CdTe hybrids.…”

Section: Pid 350 Cdte Detectormentioning

confidence: 99%

Optimization of an ultra-high-resolution parallel-hole collimator for CdTe semiconductor SPECT system

Lee¹,

Ryu²,

Cho³

et al. 2013

J. Inst.

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Recently, there has been an increase in the demand for semiconductor detectors in the field of nuclear medicine imaging. The development of semiconductor detectors using materials such as CdTe that allowed for improved spatial resolution greatly advanced the field. However, the pinhole collimator that allows for high spatial resolution compromises the sensitivity due to the small size of the hole. An improvement in both sensitivity and spatial resolution may be achieved by using a pixelated parallel-hole collimator where the hole and pixel sizes are the same. The purpose of this study was to optimize the design of a detector and collimator system to achieve excellent resolution and high sensitivity for a SPECT detector based on a CdTe detector. We performed a simulation study of the PID 350 (Ajat Oy Ltd., Finland) CdTe detector by using a Geant4 Application for Tomographic Emission (GATE). In addition to the above-mentioned pixelated parallel-hole collimator, we also designed a hexagonal parallel-hole collimator with similar hole size, and we evaluated the sensitivity and spatial resolution of each to determine which set-up was optimal for the PID 350 CdTe detector. Our results indicated that the average sensitivity and spatial resolution were 33.48% and 10.97% higher for the pixelated parallel-hole collimator than for the hexagonal parallel-hole collimator, respectively. We resolved a diameter of 0.5 mm in hot-rod phantom images with the pixelated parallel-hole collimator at a distance of 2 cm. Based on our results, we recommend the pixelated parallel-hole collimator for improving the sensitivity and spatial resolution of SPECT systems with CdTe semiconductor detectors.

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“…The thickness of the detector was 1 mm, and the physical gap between the hybrids was 1 pixel. The maximum data acquisition speed was 125 frames per a second (fps) and the minimum data acquisition speed was 5 fps [12].…”

Section: Pid 350 Cdte Pixelated Semiconductor Detectormentioning

confidence: 99%