Abstract-We demonstrate the first GaN vertical transistor on silicon, based on a 6.7-μm-thick n-p-n heterostructure grown on 6-inch silicon substrate by metal organic chemical vapor deposition (MOCVD). The devices consist of trench-gate quasi-vertical metal-oxide-semiconductor field-effect transistors (MOSFETs) with a 4 μm-thick drift layer, exhibiting enhancement-mode (E-mode) operation with a threshold voltage of 6.3 V and an on/off ratio of over 10 8 . A high off-state breakdown voltage of 645 V along with a specific on-resistance of 6.8 mΩ•cm 2 were achieved thanks to the high-quality 4 μm-thick GaN drift layer presenting a relatively low defect density and very high electron mobility (720 cm 2 /V•s). This excellent performance represents a major step towards the realization of high-performance GaN vertical power transistors on low-cost silicon substrates.