2009
DOI: 10.1002/pssc.200880889
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GaN layer growth by HVPE on m‐plane sapphire substrates

Abstract: Semipolar GaN layers were grown on m‐plane sapphire substrates by HVPE. Insertion of AlxGa1–xN (x ∼ 0.1‐0.6) layer in‐between m‐plane sapphire substrate and GaN layer promoted to improve crystalline quality and to grow of semipolar (11‐22) plane GaN layers. X‐ray diffraction (11‐22) ω‐scan rocking curve FWHM of 298 arcsec was measured for a 30 μm thick (11‐22) GaN layer. Depending on growth conditions, m‐plane GaN layer having micro‐crystallites of other orientations (mainly of (11‐24) plane GaN layer) was als… Show more

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Cited by 9 publications
(10 citation statements)
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“…The quality of GaN(1122) layers could be improved after deposition of thin Al x Ga 1-x N intermediate layers between the m-plane sapphire and GaN layer. By optimization of the m-plane sapphire substrate treatment and the layer thickness, composition and growth temperature of the intermediate Al x Ga 1-x N layer, smooth mirror-like GaN layers were achieved [35].…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The quality of GaN(1122) layers could be improved after deposition of thin Al x Ga 1-x N intermediate layers between the m-plane sapphire and GaN layer. By optimization of the m-plane sapphire substrate treatment and the layer thickness, composition and growth temperature of the intermediate Al x Ga 1-x N layer, smooth mirror-like GaN layers were achieved [35].…”
Section: Resultsmentioning
confidence: 99%
“…The GaN growth rate was 0.4-1 mm/min. The growth procedure included conditioning of the sapphire substrate followed by deposition of an up to 1.2 mm thick Al x Ga 1-x N intermediate layer and a thick GaN layer [35,36]. Nominally undoped GaN layers had a n-type conductivity with a net background donor concentration (N D -N A ) of (2-5) Â 10 18 cm À3 as evaluated by capacitance-voltage measurements.…”
Section: Introductionmentioning
confidence: 99%
“…Typical dislocation density was of the order of mid-10 8 cm À 2 and stacking fault density was below 10 5 cm À 1 [8].…”
Section: Methodsmentioning
confidence: 99%
“…As has been demonstrated for c-plane GaN, an alternative route to fabricate low-dislocation density GaN buffer layers is to deploy the epitaxial lateral overgrowth (ELOG) technique, whereby dislocation reduction is achieved by laterally growing over a masked area from a seed region [6]. A few reports have been published about ELOG on GaN(1 1 .2) surfaces [7,8]. While suitable stripe orientations and defect reduction mechanisms have been addressed, little has been reported about coalescence mechanisms and surface quality after coalescence.…”
Section: Introductionmentioning
confidence: 99%
“…Article on 2-inch-diameter sapphire substrates [10]. The surface of these templates exhibited rms roughness of about 12 nm.…”
Section: Contributedmentioning
confidence: 99%