Gan Mems Resonator Using a Folded Phononic Crystal Structure

Wang, S.; Popa, Laura C.; Weinstein, Dana

doi:10.31438/trf.hh2014.19

Cited by 20 publications

(18 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Table II compares the results calculated based on (36) and those calculated from FEM simulation. The error is due to the fact that stress field T 0 of the homogeneous plate, instead of that of the composite plate, is used in calculating the TCF according to (36). An easy remedy is to numerically simulate the mode shape of the composite plate including the compensating material embedded and then use this more accurate mode shape as the unperturbed field in (36).…”

Section: Single Layer Tcfmentioning

confidence: 98%

“…Though this is only an approximation, the same unperturbed stress field as that used in the previous section, namely the field of a homogeneous plate, will be used as T 0 in (36). Using the same test structure as shown in Fig.…”

Section: Single Layer Tcfmentioning

confidence: 99%

“…The mode shape for a homogeneous resonator is often easy to simulate, approximate, or may even be available in analytical form. On the other hand, if material embedding leads to significant change or better accuracy is needed, the mode shape after structural perturbation, namely, mode shape of the composite resonator, should be used in (36).…”

Section: Combining Materials Embedding With Temperature Changementioning

confidence: 99%

“…In this section, (36) is applied to calculate the single layer TCF. Though this is only an approximation, the same unperturbed stress field as that used in the previous section, namely the field of a homogeneous plate, will be used as T 0 in (36).…”

Section: Single Layer Tcfmentioning

confidence: 99%

“…For a given multilayer material configuration, its TCF can be derived by simply performing one single eigenfrequency simulation on the entire structure to calculate the mode shape of the composite material resonator and then use (36) to derive the overall TCF. This method fits better for fine tuning the material embedding to achieve sub-ppm TCF.…”

Section: Multilayer Resonator With Sub-ppm Tcfmentioning

confidence: 99%

See 4 more Smart Citations

Temperature coefficient of frequency modeling for CMOS-MEMS bulk mode composite resonators

Wang

Bahr

2015

IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

View full text Add to dashboard Cite

CMOS-MEMS resonators, which are promising building blocks for achieving monolithic integration of MEMS structure, can be used for timing and filtering applications, and control circuitry. SiO2 has been used to make MEMS resonators with quality factor Q > 10(4), but temperature instability remains a major challenge. In this paper, a design that uses an embedded metal block for temperature compensation is proposed and shows sub-ppm temperature stability (-0.21 ppm/K). A comprehensive analytical model is derived and applied to analyze and optimize the temperature coefficient of frequency (TCF) of the CMOS-MEMS composite material resonator. Comparison with finite element method simulation demonstrates good accuracy. The model can also be applied to predict and analyze the TCF of MEMS resonators with arbitrary mode shape, and its integration with simulation packages enables interactive and efficient design process.

show abstract

Section: Single Layer Tcfmentioning

confidence: 98%

Section: Single Layer Tcfmentioning

confidence: 99%

Section: Combining Materials Embedding With Temperature Changementioning

confidence: 99%

Section: Single Layer Tcfmentioning

confidence: 99%

Section: Multilayer Resonator With Sub-ppm Tcfmentioning

confidence: 99%

See 3 more Smart Citations