2012 IEEE International Reliability Physics Symposium (IRPS) 2012
DOI: 10.1109/irps.2012.6241815
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GaN power device and reliability for automotive applications

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Cited by 34 publications
(26 citation statements)
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“…The gate insulator is SiO 2 (thickness=50 nm, ε=3.9). Figure 6 is the electric field strength under the gate edge for a drain bias varying from 100 to 1200 V [32]. For a drain bias for 600 V, the electric field strength in the SiO 2 film is 8 MV/cm, which is near the breakdown field strength for SiO 2 .…”
Section: Reliabilitymentioning
confidence: 95%
“…The gate insulator is SiO 2 (thickness=50 nm, ε=3.9). Figure 6 is the electric field strength under the gate edge for a drain bias varying from 100 to 1200 V [32]. For a drain bias for 600 V, the electric field strength in the SiO 2 film is 8 MV/cm, which is near the breakdown field strength for SiO 2 .…”
Section: Reliabilitymentioning
confidence: 95%
“…Miniaturization of passive elements such as the inductor and capacitor by high-frequency switching and cooling system simplification will significantly reduce PCU size. Because SiC makes high output possible, as opposed to GaN, SiC power devices will be used in the boost converter and inverter, and GaN power devices will be used in the isolated DC-DC converter or low-voltage converter of auxiliary systems [6]. By using SiC power devices in the PCU of HEVs, mileage improvement of about 5-10 % is expected [7].…”
Section: Present Statusmentioning
confidence: 99%
“…11 was proposed to suppress the hole accumulation beneath the gate [15]. The p-type layer blocks the electron flow between the source and channel at the on-state and so should be formed partially in the source-channel region to maintain the electron current path.…”
Section: Breakdown Characteristic Designmentioning
confidence: 99%