Proceedings of the 5th Electronics System-Integration Technology Conference (ESTC) 2014
DOI: 10.1109/estc.2014.6962788
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GaN/SiC MMICs and packaging for use in future transmit / receive modules

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Cited by 5 publications
(3 citation statements)
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“…In order to achieve higher RF output power with higher efficiency, GaN technology is a very promising candidate for realizing designs, such as high efficiency tunable circuits, highly reconfigurable low noise power oscillators and integrated active beam forming transmit antenna arrays [35]. The current studies of this technology reveal that GaN has the potential to be the technology of choice for the next generation of transmitter/receiver (Tx/Rx) modules where high power/frequency applications [36]- [37] and several functionalities on the same chip [38] are required. intensively used for these systems at many frequency bands [41]- [42].…”
Section: List Of Tablesmentioning
confidence: 99%
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“…In order to achieve higher RF output power with higher efficiency, GaN technology is a very promising candidate for realizing designs, such as high efficiency tunable circuits, highly reconfigurable low noise power oscillators and integrated active beam forming transmit antenna arrays [35]. The current studies of this technology reveal that GaN has the potential to be the technology of choice for the next generation of transmitter/receiver (Tx/Rx) modules where high power/frequency applications [36]- [37] and several functionalities on the same chip [38] are required. intensively used for these systems at many frequency bands [41]- [42].…”
Section: List Of Tablesmentioning
confidence: 99%
“…In this same reference, a GaN-based high power amplifier with output power of 85 W and operating at S-band is reported. In 2014, an investigation [38] revealed that the next generation of GaN MMICs will cover more functionalities on the same chip.…”
Section: Use Of Gan In Reconfigurable Rf/microwavementioning
confidence: 99%
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