Gas pressure effects on thickness uniformity and circumvented deposition during sputter deposition process

Nakano, Takeo; Baba, Shigeru

doi:10.1016/j.vacuum.2005.11.005

Cited by 26 publications

(13 citation statements)

References 8 publications

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“…The improvement of the QCM(E)/QCM(C) ratio at greater T-S distances at 0.5 Pa was due to a geometrical eŠect involving the size of the erosion proˆle (22 mm in diameter) and the distance between the two QCMs (28 mm). The signiˆcantly smaller E/C ratio at higher gas pressures was considered to be caused by the diŠusive transport of the sputtered particles 5) . Since the thermalized particles near the target travelled a long distance to reach the QCM(E), and the ratio of the Edge/Center distances was more signiˆcant in the case of a shorter T-S distance, the E/C ratio of the deposition rate showed the worst thickness uniformity.…”

Section: Resultsmentioning

confidence: 99%

“…They are signiˆcantly diŠerent with regard to the energy of atoms reaching the substrate, the arrival ‰ux (deposition rate), and their proˆles. In a previous study 5) , we experimentally measured the pressure dependence of the deposition proˆle and elucidated the eŠect of thermalization for Al, Cu, and Mo. We designed a holder consisting of 3 quartz crystal thickness monitors (QCMs) and studied the dependence of thickness proˆle on the process gas pressure atˆxed T-S distances of 4 and 6 cm.…”

Section: Introductionmentioning

confidence: 99%

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Effects of Atomic Weight, Gas Pressure, and Target-to-substrate Distance on Deposition Rates in the Sputter Deposition Process

2014

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28 152-( )-J. Vac. Soc. Jpn. The transport process of sputtered atoms has been studied experimentally through deposition rate measurement by changing the target-to-substrate (T-S) distance systematically along with the gas pressure and target element. The deposition rate showed power-law decay with the T-S distance, and the slope of the log-log plot became steep at a transition pressure. The transition pressure decreased as the mass of the sputtered atoms decreased, which suggested that the transition was related to the transport of the sputtered atoms and their thermalization. Two separated thickness monitors showed that the thickness uniformity was worsened by the thermalization.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effects of Atomic Weight, Gas Pressure, and Target-to-substrate Distance on Deposition Rates in the Sputter Deposition Process

2014

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“…This method involves high temperature vacuum evaporation of the material to be coated on the support. Anatase layers have been deposited in this way, showing a super-hydrophilic behavior under band-gap irradiation as reported by several researchers in the field [91]. When using chemical vapor deposition (CVD), the substrate is exposed to volatile compounds that decompose on the substrate, leading to the desired coatings [92][93][94].…”

Section: Tio 2 /Cu Synthesis Leading To Uniform Adhesive and Antibamentioning

confidence: 90%

“…Physical vapor deposition (PVD) and chemical vapor deposition (CVD) have been widely used as mentioned in references [91][92][93][94] to coat glass, silicon, polymers, and steel with TiO 2 and other metals and metal/oxides. Work along these lines, coating TiO 2 /Cu on silica by CVD at 500 • C has been reported [159].…”

Section: Photocatalytic/catalytic Bactericidal Effects On E Coli Andmentioning

confidence: 99%

Recent Developments in Accelerated Antibacterial Inactivation on 2D Cu-Titania Surfaces under Indoor Visible Light

2017

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This review focuses on Cu/TiO 2 sequentially sputtered and Cu-TiO 2 co-sputtered catalytic/photocatalytic surfaces that lead to bacterial inactivation, discussing their stability, synthesis, adhesion, and antibacterial kinetics. The intervention of TiO 2 , Cu, and the synergic effect of Cu and TiO 2 on films prepared by a colloidal sol-gel method leading to bacterial inactivation is reviewed. Processes in aerobic and anaerobic media leading to bacterial loss of viability in multidrug resistant (MDR) pathogens, Gram-negative, and Gram-positive bacteria are described. Insight is provided for the interfacial charge transfer mechanism under solar irradiation occurring between TiO 2 and Cu. Surface properties of 2D TiO 2 /Cu and TiO 2 -Cu films are correlated with the bacterial inactivation kinetics in dark and under light conditions. The intervention of these antibacterial sputtered surfaces in health-care facilities, leading to Methicillin-resistant Staphylococcus Aureus (MRSA)-isolates inactivation, is described in dark and under actinic light conditions. The synergic intervention of the Cu and TiO 2 films leading to bacterial inactivation prepared by direct current magnetron sputtering (DCMS), pulsed direct current magnetron sputtering (DCMSP), and high power impulse magnetron sputtering (HIPIMS) is reported in a detailed manner.

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“…The growth rate and the energy distribution of the sputtered atoms can be adjusted by controlling those parameters. 17 This gives the opportunity to adjust the morphology of the deposited films. For example, at high Ar pressure the sputtered atoms are thermalized and cluster growth is promoted.…”

Section: B Deposition Systemmentioning

confidence: 99%

A compact UHV deposition system for in situ study of ultrathin films via hard x-ray scattering and spectroscopy

Couet

Diederich

Schlage

et al. 2008

Review of Scientific Instruments

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We report on a compact ultrahigh vacuum deposition system developed for in situ experiments using hard x rays. The chamber can be mounted on various synchrotron beamlines for spectroscopic as well as scattering experiments in grazing incidence geometry. The deposition process is completely remotely controlled and an ellipsometer is available for online monitoring of the layer growth process. The unique sample position in the chamber allows one to perform deposition, grazing incidence x-ray experiments, and ellipsometry measurements at the same time, enabling to correlate the x-ray analysis with parameters of the growth process. Additionally, the setup can be used to study in situ chemical and structural changes in an element specific manner by x-ray absorption spectroscopy. The flexibility and versatility of the system brings new possibilities to study the chemistry and structure of surfaces and interfaces in thin films systems during their formation.

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Gas pressure effects on thickness uniformity and circumvented deposition during sputter deposition process

Cited by 26 publications

References 8 publications

Effects of Atomic Weight, Gas Pressure, and Target-to-substrate Distance on Deposition Rates in the Sputter Deposition Process

Effects of Atomic Weight, Gas Pressure, and Target-to-substrate Distance on Deposition Rates in the Sputter Deposition Process

Recent Developments in Accelerated Antibacterial Inactivation on 2D Cu-Titania Surfaces under Indoor Visible Light

A compact UHV deposition system for in situ study of ultrathin films via hard x-ray scattering and spectroscopy

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