Extended Abstracts of the 2013 International Conference on Solid State Devices and Materials 2013
DOI: 10.7567/ssdm.2013.m-3-3
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Gate Oxide Reliability on Large-Area Surface Defects in 4H-SiC Epitaxial Wafers

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“…Trapezoid-shaped and bar-shaped defects consist of the upstream base (line) and downstream base (line), reported by Sameshima et al 16) and Ishiyama et al 27) Similarly, scraper-shaped defects also have the two lines. A common characteristic of scraper-shaped defects with the other two mentioned defects is that the fluctuation in the thermal oxide thickness occurs only along the downstream line of these defects, resulting in a negative impact on the reliability and the yield of MOS capacitors.…”
Section: Resultsmentioning
confidence: 91%
“…Trapezoid-shaped and bar-shaped defects consist of the upstream base (line) and downstream base (line), reported by Sameshima et al 16) and Ishiyama et al 27) Similarly, scraper-shaped defects also have the two lines. A common characteristic of scraper-shaped defects with the other two mentioned defects is that the fluctuation in the thermal oxide thickness occurs only along the downstream line of these defects, resulting in a negative impact on the reliability and the yield of MOS capacitors.…”
Section: Resultsmentioning
confidence: 91%