“…Research in developing materials for gating and preserving properties of large devices has seen limited success with amorphous boron nitride, [21][22] atomicallylayered high-k dielectrics, [23][24][25][26] Parylene, [27][28][29] and hexagonal boron nitride, [30][31] whereas other materials have been more successful, such as (poly)-methyl methacrylate ((P)MMA), ZEP520A photoresist, tetrafluoro-tetracyanoquinodimethane (F4TCNQ), and chromium tricarbonyl. 16,[32][33] For millimeter-scale constructions, one major issue was fabricating correspondingly large pnJs. One of the major challenges of mass producing such devices with more than one pnJ has been the required use of electron beam lithography, a costly and time-consuming technique, for the fabrication of junctions that are abrupt, with n-type and p-type regions separated by a width on the scale of several hundreds of nanometers or smaller.…”