On the annealing mechanism of AuGe/Ni/Au ohmic contacts to a two-dimensional electron gas in GaAs/AlxGa1-xAs heterostructures Koop On the annealing mechanism of AuGe/Ni/Au ohmic contacts to a two-dimensional electron gas in GaAs/AlxGa1-xAs heterostructures. Semiconductor Science and Technology, 28(2), 025006-1-025006-9.[025006]. DOI: 10.1088/0268-1242/28/2/025006 Copyright Other than for strictly personal use, it is not permitted to download or to forward/distribute the text or part of it without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license (like Creative Commons).Take-down policy If you believe that this document breaches copyright please contact us providing details, and we will remove access to the work immediately and investigate your claim. Abstract Ohmic contacts to a two-dimensional electron gas (2DEG) in GaAs/Al x Ga 1−x As heterostructures are often realized by annealing of AuGe/Ni/Au that is deposited on its surface. We studied how the quality of this type of ohmic contact depends on the annealing time and temperature, and how optimal parameters depend on the depth of the 2DEG below the surface. Combined with transmission electron microscopy and energy-dispersive x-ray spectrometry studies of the annealed contacts, our results allow for identifying the annealing mechanism. We use this for proposing a model that can predict the optimal annealing time when our commonly applied recipe is used for a certain heterostructure at a certain temperature.