Generating temperature cycle profile from in-situ climatic condition for accurate prediction of thermo-mechanical degradation of c-Si photovoltaic module

Nyarko, Frank Kwabena Afriyie; Takyi, G.; Amalu, Emeka H.; Adaramola, Muyiwa S.

doi:10.1016/j.jestch.2018.12.007

Cited by 14 publications

(9 citation statements)

References 23 publications

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“…The methodology for data collection and temperature profile generation has been extensively discussed and reported in an earlier study in Nyarko et al (2018). Temperature load profiles (for the years 2012, 2013, 2014) and test region average (TRA) thermal cycles generated from three-year real-time monitoring of installed PV modules at the test site were used in the study.…”

Section: Materials and Methodologymentioning

confidence: 99%

Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana

Nyarko

Takyi

2021

SSMT

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Purpose A numerical study on the reliability of soldered interconnects of c-Si solar photovoltaic cells has been conducted. Design/methodology/approach A three-year data (2012–2014) from outdoor weathering of PV modules was used to generate temperature cycle profiles to serve as thermal loads and boundary conditions for the investigation of the thermo-mechanical response of the soldered interconnects when subjected to real outdoor conditions using finite element analysis (FEA) Software (Ansys. 18.2). Two types of soldered interconnections, namely, Sn60Pb40 and Sn3.8Ag0.7Cu (Pb-free), were modelled in this study. Findings Life prediction results from accumulated creep energy density damage show that the solder interconnects will achieve maximum life under the 2014 thermal cycle loading. In particular, the Sn60Pb40 solder interconnection is expected to achieve 14,153 cycles (25.85 years) whilst the Pb-free solder interconnection is expected to achieve 9,249 cycles (16.89 years). Additionally, under the test region average (TRA) thermal cycle, the Pb-free and Pb-Sn solder interconnections are expected to achieve 7,944 cycles (13.69 years) and 12,814 cycles (23.4 years), respectively. The study shows that Sn60Pb40 solder interconnections are likely to exhibit superior reliability over the Pb-free solder interconnections at the test site. Practical implications This study would be useful to electronics manufacturing industry in the search for a suitable alternative to SnPb solders and also the thermo-mechanical reliability research community and manufacturers in the design of robust PV modules. Originality/value The study has provided TRA data/results which could be used to represent the test region instead of a particular year. The study also indicates that more than six thermal cycles are required before any meaningful conclusions can be drawn. Finally, the life of the two types of solders (SnPb and Pb-free) as interconnecting materials for c-Si PV have been predicted for the test region (Kumasi in sub-Saharan Africa).

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Section: Materials and Methodologymentioning

confidence: 99%

Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana

Nyarko

Takyi

2021

SSMT

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“…The study used four temperature load profiles (2012, 2013 and 2014) and test region average (TRA) thermal cycles created from three years of real-time monitoring of installed PV modules at the test site. In a previous study [20], the methodology for producing these temperature profiles was extensively discussed. The study used four temperature load profiles (2012, 2013 and 2014) and test region average (TRA) thermal cycles created from three years of real-time monitoring of installed PV modules at the test site.…”

Section: Test Rig For Data Collection and Generation Of Test Region T...mentioning

confidence: 99%

Section: Test Rig For Data Collection and Generation Of Test Region T...mentioning

confidence: 99%

Study on Creep Damage in Sn60Pb40 and Sn3.8Ag0.7Cu (Lead-Free) Solders in c-Si Solar PV Cell Interconnections under In-Situ Thermal Cycling in Ghana

2021

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A numerical study on the creep damage in soldered interconnects in c-Si solar photovoltaic cells has been conducted using equivalent creep strain, accumulated creep strain and accumulated creep energy density methods. The study used data from outdoor weathering of photovoltaic (PV) modules over a three-year period (2012–2014) to produce temperature cycle profiles that served as thermal loads and boundary conditions for the investigation of the soldered interconnects’ thermo-mechanical response when exposed to real-world conditions. A test region average (TRA) temperature cycle determined in a previous study for the 2012–2014 data was also used. The appropriate constitutive models of constituent materials forming a typical solar cell were utilized to generate accurate material responses to evaluate the damage from the thermal cycles. This study modeled two forms of soldered interconnections: Sn60Pb40 (SnPb) and Sn3.8Ag0.7Cu (Pb-free). The results of the damage analysis of the interconnections generated from the thermal cycle loads using accumulated creep strain method showed that the Pb-free solder interconnection recorded greater damage than that of the SnPb-solder interconnection for the TRA, 2012, 2013 and 2014 temperature cycles. The percentage changes from SnPb to Pb-free were 57.96%, 43.61%, 44.87% and 45.43%, respectively. This shows significant damage to the Pb-free solder under the TRA conditions. Results from the accumulated creep energy density (ACED) method showed a percentage change of 71.4% (from 1.3573 × 105 J/mm3 to 2.3275 × 105 J/mm3) in accumulated creep energy density by replacing SnPb-solder with Pb-free solder interconnection during the TRA thermal cycle. At the KNUST test site in Kumasi, Ghana, the findings show that Sn60Pb40 solder interconnections are likely to be more reliable than Pb-free solder interconnections. The systematic technique employed in this study would be useful to the thermo-mechanical reliability research community. The study also provides useful information to PV design and manufacturing engineers for the design of robust PV modules.

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“…Long-term reliability tests of photovoltaic (PV) modules are required to guarantee an acceptable module lifetime (e.g., 25 years). [1] Outdoor PV modules operate under various stress factors, including humidity, temperature, sunlight, wind speed, and dust. [2][3][4][5] However, it is unrealistic to perform outdoor field tests over long periods.…”

Section: Introductionmentioning

confidence: 99%

Analysis of Accelerated Damp Heat Test for Degradation Analysis and Recovery Method of Photovoltaic Module

et al. 2022

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Conventional damp heat (DH) tests conducted at 85 °C and 85% relative humidity (RH) for module degradation cannot reproduce outdoor failures in a short time and it may take up to 4000 h to reproduce multienvironmental stress values. Therefore, an accelerated DH test for photovoltaic (PV) modules is proposed, in which temperatures up to 120 °C are applied to accelerate the degradation mechanism while keeping the humidity fixed at 85%RH and module performance and electroluminescence images are investigated. The environmental stress detected after 600 h at 120 °C/85%RH is comparable with the results of the DH test recorded at 85 °C/85%RH for ≈5000 h. Moreover, the power drop by replacing the backsheet/ethylenevinyl acetate (EVA) and backsheet/EVA/solar cell for one cell area in the PV module after 1000 h DH test at 85 °C and 85%RH is mitigated. After replacing the EVA and backsheet of one cell from the minimodule, a power recovery of 1.6% is achieved. By replacing the backsheet, EVA, and one solar cell from the minimodule, a power recovery of 1.9% is achieved. This analysis indicates that instead of replacing the complete module, it is possible to replace the damaged part of the module.

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Generating temperature cycle profile from in-situ climatic condition for accurate prediction of thermo-mechanical degradation of c-Si photovoltaic module

Cited by 14 publications

References 23 publications

Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana

Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana

Study on Creep Damage in Sn60Pb40 and Sn3.8Ag0.7Cu (Lead-Free) Solders in c-Si Solar PV Cell Interconnections under In-Situ Thermal Cycling in Ghana

Analysis of Accelerated Damp Heat Test for Degradation Analysis and Recovery Method of Photovoltaic Module

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