We study the effect of H + and OH − diffusion on the hydrogen evolution reaction in unbuffered aqueous electrolyte solutions of mildly acidic pH values. We demonstrate that the cathodic polarization curves measured on a Ni rotating disk electrode in these solutions can be modeled by assuming two irreversible reactions, the reduction of H + and that of water molecules, both following Erdey-Grúz-Volmer-Butler kinetics. The reduction of H + yields a transport-limited and thus, rotation rate-dependent current at not very negative potentials. At more cathodic potentials the polarization curves are dominated by the reduction of water and no mass transfer limitation seems to apply for this reaction. Although prima facie the two processes may seem to proceed independently, by the means of finite-element digital simulations we show that a strong coupling (due to the recombination of H + and OH − to water molecules) exists between them. We also develop an analytical model that can well describe polarization curves at various values of pH and rotation rates. The key indication of both models is that hydroxide ions can have an infinite diffusion rate in the proximity of the electrode surface, a feature that can be explained by assuming a directed Grotthuss-like shuttling mechanism of transport. A common problem of base metal electroplating is that the deposition of electroactive metals (e.g., Zn, Co, Fe or Ni) is almost inevitably accompanied by hydrogen evolution. In aqueous solutions hydrogen evolution always occurs if current is made high enough to exceed the limiting current of the deposited metal.1 In acidic solutions hydrogen may be formed as a result of H + reduction,while in solutions of pH > 7, the primary source of hydrogen is the electroreduction of water itself:Hydrogen evolution presents several ramifications for electrochemical plating processes. From a strictly technological point of view, the evolution of hydrogen is a serious concern because it reduces the faradaic efficiency of metal deposition, thereby increasing the amount of time and energy utilized to deposit the desired amount of metal at a given total current density. Another problem of hydrogen codeposition is that it can affect the structural and mechanical properties of the metal and can cause embrittlement. 1 Furthermore, hydrogen can also affect the kinetics of layer growth: if hydrogen adsorbs more efficiently on certain crystal planes of the metal, it may block these planes from further deposition so that the metal would preferentially grow on other planes.2 This inhomogeneous growth presents difficulties for the deposition of compact metal layers at the best -that is, if the accumulated gas does not impair the entire plating process. Finally, hydrogen evolution also results in the removal of H + ions from the diffusion layer. Increasing the near-surface pH may alter the intended chemical and electrochemical reactions at the interface. For example, if the solution at the interface becomes sufficiently alkaline, it may cause the solubility of a...