Abstract:With the shrinking feature size and increasing aspect ratios of interconnects in DSM chips, the coupling noise between adjacent interconnects has become a major signal integrity (SI) issue, giving rise to crosstalk failures. In older technologies, SI issues have been ignored because of high noise immunity of the CMOS circuits and the process technology. However, as CMOS technologies lower down the supply voltage as well as the threshold voltage of a transistor, digital designs are more and more susceptible to … Show more
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