Geometric parameter design of a cantilever probing needle used in epoxy ring probe card

Chang, Dar-Yuan

doi:10.1016/j.jmatprotec.2008.01.049

Cited by 5 publications

(3 citation statements)

References 9 publications

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“…In performing the simulations, the Young's modulus and Poisson's ratio of the needle were specified as 290.85 GPa and 0.28, respectively [2]. Furthermore, the pad was assumed to be a rigid body [8]. The overdrive distance was specified as 1 mil and was represented in the simulations by a movement of the pad in the vertical (upward) direction.…”

Section: Validation Of Optimization Resultsmentioning

confidence: 99%

“…It was shown that the scrub marks produced by the optimized probe card were both shorter and of a more uniform length than those produced by the original design. Chang and Choi [8] constructed an FE model of a single needle in an epoxy ring probe card and then applied the Taguchi method to explore the effects of the various needle parameters on the scrub mark length and contact force at the probe tip. The results showed that the scrub mark length was determined principally by the etch length and the distance between the needle tip and the epoxy fixed end, while the contact force was governed mainly by the etch length and the needle diameter.…”

Section: Introductionmentioning

confidence: 99%

“…Tu are with the Department of Mechanical Engineering, National Chung Cheng University, Chiayi 621, Taiwan (e-mail: imedsl@ccu.edu.tw; e1587154@ms54.hinet.net; odooa0228@gmail.com). A.-H. Liu, C.-F. Huang, and Y.-C. Lee are with the ChipMOS Technologies Inc., Tainan 744, Taiwan (e-mail: john_liu@chipmos.com; c.f._huang@chipmos.com; yi-chang_lee@chipmos.com).Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org.Digital Object Identifier 10.1109/TCPMT.2011.Probe card and probe needles[8].…”

mentioning

confidence: 99%

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Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm

Liu

Chang

et al. 2011

IEEE Trans. Compon., Packag. Manufact. Technol.

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Wafer testing in the semiconductor industry is generally performed using a multilayer probe card. In this paper, Castigliano's second theorem is used to derive analytical formulae for the contact force and scrub mark length generated during the probing test. The formulations are then integrated with a multiobjective programming algorithm to optimize the probe needle parameters in such a way as to ensure a uniform contact force and a minimum scrub mark length. The validity of the analytical model is confirmed by comparing the solutions obtained for the contact force and scrub mark length with the equivalent results obtained from finite element simulations. The effectiveness of the analytical model and optimization procedure is demonstrated by optimizing the needle parameters of a commercial four-layer probe card. It is shown that the optimized probe card not only produces a more uniform contact force than the original probe card but also yields a shorter and more uniform scrub mark length.Index Terms-Castigliano's theorem, energy method, epoxy ring probe card, finite element method, wafer-level probing test.

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Section: Validation Of Optimization Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

mentioning

confidence: 99%

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Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm

Liu

Chang

et al. 2011

IEEE Trans. Compon., Packag. Manufact. Technol.

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Novel analysis model for investigation of contact force and scrub length for design of probe card

Liu

Chang

Liu³

et al. 2010

Microelectronics Reliability

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Design and Fabrication of Anisotropic Conductive Film for Application of Probe Card

2017

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Prior to integrated circuit (IC) packaging, die performance must be verified using probe cards to screen for defective products. With the decrease in IC line width, the dimensions of the pads used for performance verification and the spacing between adjacent pads have also decreased. However, when the pad pitch is reduced to less than 30 μm, commonly used probe cards will face manufacturing problems in miniaturization. To resolve probe card manufacturing problems caused by the miniaturization of IC components, the use of an anisotropic conductive film (ACF) in probe cards was proposed in this study. Theoretical calculations and experimental testing of this probe structure were conducted to demonstrate the feasibility of this concept.In theoretical calculations, composite material and buckling theory were utilized to evaluate the buckling behavior of the ACF. In experimental testing, photolithography and electroplating techniques were used to control the line width and spacing intervals of the micron-scale metal wires in the ACF. After the ACF was fabricated, the mechanical properties of the ACF during wafer testing were assessed. Theoretical analyses and experimental testing verified that ACFs can potentially be applied to the performance verification of IC products. In the ACF structure, multiple probes came into contact with each pad. Therefore, ACFs can potentially be applied to the performance verification of IC components with pad diameters of less than 20 μm. The results of this study directly benefit the miniaturization of ICs.

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Geometric parameter design of a cantilever probing needle used in epoxy ring probe card

Cited by 5 publications

References 9 publications

Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm

Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm

Novel analysis model for investigation of contact force and scrub length for design of probe card

Design and Fabrication of Anisotropic Conductive Film for Application of Probe Card

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