Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux

A data-driven approach combining together the experimental laser soldering, finite element analysis and machine learning, has been utilized to predict the morphology of interfacial intermetallic compound (IMC) in Sn-xAg-yCu/Cu (SAC/Cu) system. Six types of SAC solders with varying weight proportion of Ag and Cu, have been processed with fiber laser at different magnitudes of power (30-50 W) and scan speed (10 -240 mm/min), and the resultant IMC morphologies characterized through scanning electron microscope are categorized as prismatic and scalloped ones. For the different alloy composition and laser parameters, finite element method (FEM) is employed to compute the transient distribution of temperature at the interface of solder and substrates. The FEM-generated datasets are supplied to a neural network that predicts the IMC morphology through the quantified values of temperature dependent Jackson parameter (αJ). The numerical value of αJ predicted from neural network is validated with experimental IMC morphologies. The critical scan speed for the morphology transition between prismatic and scalloped IMC is estimated for each solder composition at a given power. Sn-0.7Cu having the largest critical scan speed at 30 W and Sn-3.5Ag alloy having the largest critical scan speed at input power 2 values of 40 W and 50 W, thus possessing the greatest likelihood of forming prismatic interfacial IMC during laser soldering, can be inferred as most suitable SAC solders in applications exposed to shear loads.

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“…9. Assuming Cu as a moderately smooth surface, amplitude = 10,000 and the timeexponent m = 0.03 [40] .…”

Section: Initial Conditions Boundary Conditions and Numerical Implementationmentioning

confidence: 99%

A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering

Kunwar

Liu

et al. 2020

Journal of Materials Science & Technology

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Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material

Cheng

2019

J Mater Sci: Mater Electron

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Wettability, interfacial reaction and mechanical properties of Sn/Sn–CuZnAl solder and Cu sheet during solid–liquid diffusion

Sun

Chen

Zhang

et al. 2019

J Mater Sci: Mater Electron

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Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux

Cited by 5 publications

References 51 publications

A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering

A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering

Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material

Wettability, interfacial reaction and mechanical properties of Sn/Sn–CuZnAl solder and Cu sheet during solid–liquid diffusion

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