Glass‐transition temperature in the curing process of bismaleimide modified with diallylbisphenol A

Boey, Freddy; Xiong, Yan; Rath, Santosh Kumar

doi:10.1002/app.13497

Cited by 11 publications

(4 citation statements)

References 16 publications

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“…Theoretically, the homopolymerization of BMPM in the pure BMPM/DBA system is more difficult than the copolymerization reactions between BMPM and DBA because of the high steric effect existing in the BMPM molecule. It has been proposed that the BMI homopolymerization occurs after the copolymerization between BMI and DBA32 when the molar ratio of BMI to DBA is higher than 1:1. The addition of DBA gives rise to the copolymerization between BMI and DBA.…”

Section: Resultsmentioning

confidence: 99%

Effect of organoclay on the curing reactions in bismaleimide/diallyl bisphenol a resin

Meng

2005

J. Polym. Sci. A Polym. Chem.

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4,4Ј-Bismaleimidodiphenyl methane (BMPM)/2,2Ј-diallyl bisphenol A (DBA)/organoclay nanocomposites were synthesized. The effects of organoclays on the curing reactions in the BMPM/DBA system at low temperatures (ene reaction) and high temperatures (Diels-Alder reaction, homopolymerization of BMPM, and alternative copolymerization) were investigated with differential scanning calorimetry and Fourier transform infrared techniques. The results showed that these reactions were affected to different extents in the presence of organoclays. The ene reaction was accelerated to different degrees depending on the acidity of the modifier and the accessibility of the organoclays used. The exfoliation degree of organoclays in the prepolymers showed great effects on the curing behavior of BMPM/DBA. When an organoclay was less intercalated, the curing behavior of the system was different from that of neat BMPM/ DBA. On the other hand, when the organoclay was better exfoliated in prepolymers, the curing behavior of the system was similar to that of the neat BMPM/DBA system. However, even in this case, the reactions at high temperatures occurred in different ways in the presence of an organoclay.

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Section: Resultsmentioning

confidence: 99%

Effect of organoclay on the curing reactions in bismaleimide/diallyl bisphenol a resin

Meng

2005

J. Polym. Sci. A Polym. Chem.

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“…The Tg-conversion relationship after isothermal curing at various temperatures for 1,1 0 -(methylene-di-4, 1-phenylene) bismaleimide (BMI), modified with DABA, was investigated by Y. Xiong et al [129]. The DiBenedetto equation was used to model this relationship for the formulation of DABA-1 (BMI:DABA, 1:1).…”

Section: Kinetics Of Alder-ene Polymerizationmentioning

confidence: 99%

Maleimide-Based Alder-Enes

Chandran

Nair

2014

Handbook of Thermoset Plastics

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“…Up‐to‐date, many methods, such as blending with engineering thermoplastics5, 6 or thermosetting resins and7, 8 reinforcing by fillers9 or fibers,10 have been developed to modify BDM. Among them, the modification of BDM by o,o′‐diallylbisphenol A (DBA) has been proved to be an effective route, which not only effectively improves the toughness but also improves the processing characteristics of BDM 11. However, the dielectric properties and thermal stability of BDM/DBA system still needs to be improved for high‐performance dielectrics.…”

Section: Introductionmentioning

confidence: 99%

High‐performance hyperbranched poly(phenylene oxide) modified bismaleimide resin with high thermal stability, low dielectric constant and loss

Huang

Liang

et al. 2010

J of Applied Polymer Sci

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High-performance hyperbranched poly(phenylene oxide)-modified bismaleimide resin with high thermal stability, low dielectric constant, and loss was developed, which is made up of hyperbranched poly(phenylene oxide) (HBPPO), 4,4 0 -bismaleimidodiphenylmethane (BDM), and o, o 0 -diallylbisphenol A (DBA). The curing reactivity, morphology, and performance of BDM/DBA/HBPPO resin were systemically investigated, and similar investigations for BDM/ DBA resin were also carried out for comparison. Results show that BDM/DBA/HBPPO and BDM/DBA resins have similar curing mechanism, but the former can be cured at lower temperature than the later; in addition, cured BDM/ DBA/HBPPO resin with suitable HBPPO content has better thermal stability and dielectric properties (lower dielectric constant and loss) than BDM/DBA resin. The difference in macroproperties between BDM/DBA/HBPPO and BDM/ DBA resins results from the different chemical structures and morphologies of their crosslinking networks.

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Glass‐transition temperature in the curing process of bismaleimide modified with diallylbisphenol A

Cited by 11 publications

References 16 publications

Effect of organoclay on the curing reactions in bismaleimide/diallyl bisphenol a resin

Effect of organoclay on the curing reactions in bismaleimide/diallyl bisphenol a resin

Maleimide-Based Alder-Enes

High‐performance hyperbranched poly(phenylene oxide) modified bismaleimide resin with high thermal stability, low dielectric constant and loss

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