Grain boundary migration and Zener pinning in particle-containing copper crystals

Humphreys, F.J.; Ardakani, M.G.

doi:10.1016/1359-6454(95)00421-1

Cited by 126 publications

(55 citation statements)

References 11 publications

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“…(1)). Similar effects have also been reported for particle-containing copper single crystals [45], Fe-Cr alloys [48] and Fe-Si transformer steel [49].…”

Section: Impact Of Concurrent Precipitation On Texturesupporting

confidence: 64%

“…They suggested that the reason for the P and ND rotated cube-orientated grains to grow faster than other grains is due to their approximate 38 o <111> orientation relationship (∑7-type CSL grain boundary) with the neighbouring Cu deformation texture component. The reason is that the special boundaries of this kind are more ordered and have a lower specific grain boundary energyup to ~10% lower than those of regular high-angle grain boundaries [45]. In more recent investigations, even larger differences in the energies between ∑7 and regular high angle grain boundaries have been reported in Al films [46] and polycrystalline nickel [1], respectively.…”

Section: Impact Of Concurrent Precipitation On Texturementioning

confidence: 94%

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Evolution in microstructure and properties during non-isothermal annealing of a cold-rolled Al–Mn–Fe–Si alloy with different microchemistry states

Huang

Engler

et al. 2015

Materials Science and Engineering: A

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The softening behaviour during non-isothermal annealing of a cold-rolled Al-Mn-Fe-Si model alloy was studied as a function of the state of microchemistry, in terms of the solute level of Mn, size and spatial distribution of the Mn-bearing dispersoids, as well as their temporal evolution. Microchemistry significantly affects the recrystallization microstructure, crystallographic texture as well as the mechanical property of the investigated alloy after non-isothermal annealing. The nucleation and growth of grains with different orientations are strongly dependent on both annealing temperature and microchemistry, in that pre-existing dispersoids have a less profound effect on retarding recrystallization than dispersoids forming concurrently during back-annealing. Strong concurrent precipitation suppresses nucleation and retards recrystallization, which finally leads to a coarse and pan-cake shaped grain structure, accompanied by strong P {011}<566> and/or M {113}<110> texture components and a relatively weaker ND-rotated cube {001}<310> component. A refined grain structure with medium strength P and cube {001}<100> components is obtained when the pre-existing dispersoids are coarser and fewer, and concurrent precipitation is limited. Porientated grains are less affected by second phase particles and experience a growth advantage at low annealing temperatures (<350°C), while M-orientated grains appear at higher temperatures. The intensity of the P texture does not necessarily increase with increasing supersaturation of Mn as observed during isothermal annealing, whereas the level of supersaturated Mn promotes the strength of the M texture. The mechanisms behind are discussed.

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“…(1)). Similar effects have also been reported for particle-containing copper single crystals [45], Fe-Cr alloys [48] and Fe-Si transformer steel [49].…”

Section: Impact Of Concurrent Precipitation On Texturesupporting

confidence: 64%

Section: Impact Of Concurrent Precipitation On Texturementioning

confidence: 94%

Evolution in microstructure and properties during non-isothermal annealing of a cold-rolled Al–Mn–Fe–Si alloy with different microchemistry states

Huang

Engler

et al. 2015

Materials Science and Engineering: A

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“…45 The stress keeps dropping with time during a given dwell (below), but the pinning pressure drops (with F prec /d p ) from cycle to cycle as the precipitates coarsen. For sufficiently low-strain ranges and initial precipitate sizes, the rate of recrystallization remains strongly reduced until after significant coarsening.…”

Section: Precipitate Coarseningmentioning

confidence: 99%

“…45 The driving pressure is proportional to the density of mobile dislocations 38 which varies with the square of the stress. 58 The pinning pressure is proportional to the volume fraction, F prec , and inversely proportional to the average precipitate size, d p 26 , i.e., it decreases as the precipitates coarsen.…”

Section: Precipitate Coarseningmentioning

confidence: 99%

A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

Børgesen

Wentlent

Hamasha

et al. 2018

Journal of Elec Materi

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The present work offers both a complete, quantitative model and a conservative acceleration factor expression for the life span of SnAgCu solder joints in thermal cycling. A broad range of thermal cycling experiments, conducted over many years, has revealed a series of systematic trends that are not compatible with common damage functions or constitutive relations. Complementary mechanical testing and systematic studies of the evolution of the microstructure and damage have led to a fundamental understanding of the progression of thermal fatigue and failure. A special experiment was developed to allow the effective deconstruction of conventional thermal cycling experiments and the finalization of our model. According to this model, the evolution of damage and failure in thermal cycling is controlled by a continuous recrystallization process which is dominated by the coalescence and rotation of dislocation cell structures continuously added to during the hightemperature dwell. The dominance of this dynamic recrystallization contribution is not consistent with the common assumption of a correlation between the number of cycles to failure and the total work done on the solder joint in question in each cycle. It is, however, consistent with an apparent dependence on the work done during the high-temperature dwell. Importantly, the onset of this recrystallization is delayed by pinning on the Ag 3 Sn precipitates until these have coarsened sufficiently, leading to a model with two terms where one tends to dominate in service and the other in accelerated thermal cycling tests. Accumulation of damage under realistic service conditions with varying dwell temperatures and times is also addressed.

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“…(8), and due to particle stimulated nucleation. Considering relatively small particles of diameter less than 1 μm, the dominating mechanism will be Zener pinning [71,4]. Fig.…”

Section: Influence Of Impurity Particlesmentioning

confidence: 99%

Microstructure evolution during dynamic discontinuous recrystallization in particle-containing Cu

Hallberg

Svendsen

Kayser

et al. 2014

Computational Materials Science

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Grain boundary migration and Zener pinning in particle-containing copper crystals

Cited by 126 publications

References 11 publications

Evolution in microstructure and properties during non-isothermal annealing of a cold-rolled Al–Mn–Fe–Si alloy with different microchemistry states

Evolution in microstructure and properties during non-isothermal annealing of a cold-rolled Al–Mn–Fe–Si alloy with different microchemistry states

A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

Microstructure evolution during dynamic discontinuous recrystallization in particle-containing Cu

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