Grain boundary structures in rapidly solidified CuZnAl alloys

Perkins, Jeff; Rayment, J.J.; Cantor, B.; Cahn, Robert W.

doi:10.1016/0036-9748(81)90018-1

Cited by 13 publications

(2 citation statements)

References 5 publications

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“…168), and Cu-Zn-Al (Refs. 169,170) alloys. Rapid solidification processing can be used to obtain fine grained materials which display the shape memory phenomenon resulting from martensitic transformations between the ordered structures (P'l~Pi in Cu-Zn-Al; P'l~y'l in Cu-Ni-Al).…”

Section: Rapid Solidification Of Other Intermetallicsmentioning

confidence: 99%

Rapid solidification of intermetallic compounds

Koch¹

1988

International Materials Reviews

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This review surveys recent studies of rapid solidification at alloy compositions where the equilibrium phase is an intermetallic compound (or mixture of intermetallic compounds). Glass forming intermetallic compositions are considered and criteria for 'easy' glass formation are discussed. The limited data on synthesis of intermetallics from amorphous precursors are reviewed. This is a promising route to refine the microstructure of intermetallics with the potential for improved mechanical properties. It is an area that needs more study. The greatest effort has been devoted to studies of rapid solidification of the nickel-, iron-, or titanium-base aluminides. Rapid solidification of nickel base aluminides results in a refined microstructure (grain size and/or antiphase domain size) which can influence mechanical properties. The equilibrium crystal structure is maintained, however. Certain rapidly solidified Fe-AI-C base alloys can form a metastable fcc or L 1 2 structure (a point of continuing controversy) with good strength and ductility. The titanium base aluminides exhibit a marked tendency for formation of metastable structures on rapid quenching. The potential for improving the ductility of these compounds has made rapid solidification of Ti 3 AI and TiAI the subject of much recent activity.1MR/191

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Section: Rapid Solidification Of Other Intermetallicsmentioning

confidence: 99%

Rapid solidification of intermetallic compounds

Koch¹

1988

International Materials Reviews

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“…Initial studies on Cu-Zn-A1 and Cu-Ni-A1 alloys (1 -3) demonstrated that there is no difficulty in making wire on ribbon by a rapid solidification route. More recent work on similar alloys using a different process route (4) has shown that the transformation temperatures were lowered and the differences in data compared with earlier work have been associated with the exact alloy compositions and subsequent solid state quench rate after leaving the rapid solidificati.on zone (5).…”

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confidence: 95%

Rapid Solidification Processing of Copper Base Memory Alloys

Wood

1982

J. Phys. Colloques

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An investigat.ion into the effect of melt spinning variables and subsequent heat treatments on Cu-Ni-A1 shape memory alloys is described. Transformation temperatures for a wide range of alloys have been measured by Differential Scanning Calorimetry. Heat treatments below 3 0 0~~ result in a stabilisationof transformation temperatures, whereas those above qive rise to extensive precipitation and a gradual fading of the reversible martensite reaction.

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