2019
DOI: 10.1109/led.2019.2944491
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Grain Size Engineering of Ferroelectric Zr-doped HfO2for the Highly Scaled Devices Applications

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Cited by 55 publications
(30 citation statements)
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“…The dielectric/electrode interfacial regions can form during the ALD and post annealing processes as indicated on Figure . Two pancake-like grains (G 1 and G 2 ) with long horizontal diameters (>10 nm) are detected in Figure based on the approach applied by Liao et al . As is seen, grains are elongated along the W electrodes, indicating the fact that, due to the short annealing time (30 s), most of the distortion imposed by the nanolaminate structure is not recovered during the annealing process.…”
Section: Resultsmentioning
confidence: 96%
“…The dielectric/electrode interfacial regions can form during the ALD and post annealing processes as indicated on Figure . Two pancake-like grains (G 1 and G 2 ) with long horizontal diameters (>10 nm) are detected in Figure based on the approach applied by Liao et al . As is seen, grains are elongated along the W electrodes, indicating the fact that, due to the short annealing time (30 s), most of the distortion imposed by the nanolaminate structure is not recovered during the annealing process.…”
Section: Resultsmentioning
confidence: 96%
“…Liao et al optimized the ferroelectricity of HfO 2 /ZrO 2 bilayers through decreasing the individual film thickness of HfO 2 and ZrO 2 by controlling atomic layer deposition (ALD) cycle. 19 The reduced grain radius from 16.6 nm to 13.0 nm contributed to the performance enhancement. Recently, Shin et al reported the ferroelectricity of HfO 2 nanodots with a diameter scaling down to 7 nm, which verified the importance of size effects.…”
Section: Introductionmentioning
confidence: 99%
“…10,[14][15][16] Among all control strategies, a few experiments have been performed to improve the properties of HfO 2 -based ferroelectric thin films through size effects. [17][18][19] Kim et al's group reported almost the same ferroelectricity in a 10 nm-thick single layer Hf 0.5 Zr 0.5 -O 2 film and 40 nm-thick Hf 0.5 Zr 0.5 O 2 film, which, however, has a 1 nm-thick Al 2 O 3 insertion layer in the middle position. 18 The insertion of Al 2 O 3 could largely block the continuous grain growth of Hf 0.5 Zr 0.5 O 2 films, so an m-phase could be inhibited.…”
Section: Introductionmentioning
confidence: 99%
“…Single domain switching (only two memory states) has been observed in Si-doped HfO 2 -FeFETs with a gate length of 30 nm. [22,28] To improve the multilevel capability in the highly scaled device, film engineering and nonplanar device structures have been reported, [23,[30][31][32] but more efforts are still needed for the practical applications. Moreover, the risk of reliable operation might exist due to the intrinsic stochasticity of individual domain switching and the variation among domains.…”
Section: Introductionmentioning
confidence: 99%