“…Further, previous studies showed the formation of a thin metallic Cu-nanoparticles layer at the interface alloy-IGC defect [20], that could be due to dissolution of the Cu-rich intergranular precipitates [19,21], and/or to the matrix dissolution [22]. This Cu-rich layer could protect the interior of the attacked grains from further corrosive environment in AA 2024 [19,23,24]. However, Cu could also provide effective cathodic support for oxygen and/or protons reduction on the walls of the IGC defects [24].…”