Green Precursors and Soft Templating for Printing Porous Carbon‐Based Micro‐supercapacitors

Lochmann, Stefanie; Kintzel, Susann; Bräuniger, Yannik; Otto, T.N.; Zhang, En; Grothe, Julia; Kaskel, Stefan

doi:10.1002/chem.202003124

Cited by 5 publications

(3 citation statements)

References 47 publications

(90 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Finally, with the continuing innovation in manufacturing methods, there is growing demand for researchers to expand the application fields of the nanoskiving technique. In addition to the typical applications to optical devices and electrochemical devices, the use of nanostructures fabricated by nanoskiving in energy harvesting, [ 128 ] biomolecular detectors, [ 129 ] and data storage [ 130 ] applications is also attracting increasing attention. All these applications will be possible when the preparation of the nanostructures becomes more reliable and controllable with the continuous improvements being made in nanoskiving technology.…”

Section: Discussionmentioning

confidence: 99%

Recent Progress in the Nanoskiving Approach: A Review of Methodology, Devices, and Applications

Fang

Yan

Geng

2021

Adv Materials Technologies

View full text Add to dashboard Cite

Nanoskiving is a unique nanomanufacturing method that can be used to cut out nanostructures directly with well‐controlled shapes and sizes. Over the past 10 years, nanoskiving techniques have evolved in terms of optimization of the sectioning parameters and development of the transfer and alignment approaches. In addition, the range of compatible materials for nanoskiving is expanding via combination of the technique with other bottom–up and top–down methods; for example, soft materials such as block polymers and hard materials such as cemented carbide and semiconductor materials are now able to be nanosized successfully, despite previously being considered incompatible with nanoskiving technology. The preparation of these structures by the nanoskiving method opens a convenient door to verification of the application of this technique to device miniaturization in fields including optics, electrochemistry, electronics, and biology. This review outlines the advances made in nanoskiving, including those in the fabrication process, the development of suitable applications, and the challenges and opportunities for future exploration of the technology.

show abstract

Section: Discussionmentioning

confidence: 99%

Recent Progress in the Nanoskiving Approach: A Review of Methodology, Devices, and Applications

Fang

Yan

Geng

2021

Adv Materials Technologies

View full text Add to dashboard Cite

show abstract

“…[64] Instead of using photoresist, Lochmann et al employed a combination of UV curing and template-assisted methods to prepare porous carbon-based MSCs. MSCs exhibit a interdigital line width of only 250 nm and a interdigital distance of 1 mm, achieving a specific capacitance of 0.21 F cm À 2 [65] . While photolithography offers clear advantages, the cumbersome process, the high cost of photoresists, together with the contamination caused by their removal from electrodes are significant barriers to the large-scale manufacture of MSCs.…”

Section: Large-scale Fabrication Of Devicementioning

confidence: 99%

Large‐Scale Production and Integrated Application of Micro‐Supercapacitors

Xie,

Zhang,

et al. 2024

Chemistry A European J

View full text Add to dashboard Cite

Micro‐supercapacitors, emerging as promising micro‐energy storage devices, have attracted significant attention due to their unique features. This comprehensive review focuses on two key aspects: the scalable fabrication of MSCs and their diverse applications. The review begins by elucidating the energy storage mechanisms and guiding principles for designing high‐performance devices. It subsequently explores recent advancements in scalable fabrication techniques for electrode materials and micro‐nano fabrication processes for micro‐devices. The discussion encompasses critical application domains, including multifunctional MSCs, energy storage integration, integrated power generation, and integrated applications. Despite notable progress, there are still some challenges such as large‐scale production of electrode material, well‐controlled fabrication technology, and scalable integrated manufacture. The summary concludes by emphasizing the need for future research to enhance micro‐supercapacitor performance, reduce production costs, achieve large‐scale production, and explore synergies with other energy storage technologies. This collective effort aims to propel MSCs from laboratory innovation to market viability, providing robust energy storage solutions for MEMS and portable electronics.

show abstract

“…However, the compact thin films pyrolyzed at 800 °C and 700 °C showed remarkably low specific resistances which are about three times lower than for comparable carbon precursors at those temperatures. 40 Therefore, we focused especially on pyrolysis temperatures between 700 and 900 °C for the subsequent preparation of micro-supercapacitors.…”

Section: Precursor Characterizationmentioning

confidence: 99%