2015
DOI: 10.1002/adma.201502792
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Green Processing of Metal Oxide Core–Shell Nanoparticles as Low‐Temperature Dielectrics in Organic Thin‐Film Transistors

Abstract: TiO2 , Fe3 O4, AlOx , ITO (indium tin oxide), and CeO2 nanoparticles are tailored to exhibit excellent dispersability in deionized water and alcohols. The latter provides an ecofriendly solution for processing metal oxide nanoparticles at a neutral pH. Water-processed dielectrics from the metal oxide nanoparticles are incorporated into organic thin-film transistors fabricated on rigid and flexible substrates.

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Cited by 17 publications
(11 citation statements)
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“…In addition, the remarkable stability and surface positive charge provided by the PA‐SAM molecules in aqueous conditions can be applied to other metal oxide nanoparticle cores . Therefore, surface modification with these PA‐SAMs establishes a universal approach for the stabilization of metal oxide nanoparticles which can be of value in other fields of nanotechnology .…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the remarkable stability and surface positive charge provided by the PA‐SAM molecules in aqueous conditions can be applied to other metal oxide nanoparticle cores . Therefore, surface modification with these PA‐SAMs establishes a universal approach for the stabilization of metal oxide nanoparticles which can be of value in other fields of nanotechnology .…”
Section: Introductionmentioning
confidence: 99%
“…As semiconducting material the asymmetric 2-tridecyl [1]benzothieno [3,2-b][1]benzothiophene (C 13 -BTBT) was utilized, a small molecule which showed excellent mobilities in previous experiments. [ 16,17 ] Figure 3 b shows the changes in capacitance as direct effect of the doping of the SAM. In Table 2 the corresponding capacitance data of the layers at 1 V at 500 kHz can be seen.…”
Section: Doi: 101002/adma201503911mentioning
confidence: 98%
“…Polymer dielectrics usually afford excellent mechanical flexibility and are compatible with inexpensive plastic foils since they can be processed by coating or printing techniques at low temperatures, but polymers generally have low k, which makes it difficult to meet the requirements for high-density charge storage [7][8][9]. Therefore, the growing appeal in new dielectric materials has arisen primarily from the necessity for an inexpensive device fabrication process and the reduction of the operating voltages required for new flexible/printed electronic technologies [10][11][12].…”
Section: Introductionmentioning
confidence: 99%