1992
DOI: 10.4028/www.scientific.net/kem.71.195
|View full text |Cite
|
Sign up to set email alerts
|

Grinding Mechanisms and Strength Degradation for Ceramics

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

4
30
0
1

Year Published

2003
2003
2022
2022

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 35 publications
(35 citation statements)
references
References 0 publications
4
30
0
1
Order By: Relevance
“…Generally, strain rates for chip formation in abrasive adjustments are much greater than the minimum required for adiabatic deformation. This means that no appreciable amount of plastic shearing energy is dissipated as heat during deformation [36], particularly for heat-resistant materials, such as ceramics. Shearing energy is considered to plastically form the chip [36].…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…Generally, strain rates for chip formation in abrasive adjustments are much greater than the minimum required for adiabatic deformation. This means that no appreciable amount of plastic shearing energy is dissipated as heat during deformation [36], particularly for heat-resistant materials, such as ceramics. Shearing energy is considered to plastically form the chip [36].…”
Section: Discussionmentioning
confidence: 99%
“…Specific removal energy is associated with bur-prosthesis interactions in removal processes [36]. SEM micrographs in Figs.…”
Section: Discussionmentioning
confidence: 99%
“…The median cracks can extend much farther below the surface and thereby form SSD [4,5]. Although grinding is considered as the production technology which is widely used for manufacturing high-precision optical component, the grinding processes will cause damages and these damages usually reduces the strength, heat resistance, laser damage threshold, and other properties of the components [6,7]. Therefore, it is essential for manufacturing hard brittle component with high surface quality, ultra-precision, and fewer SSDs to understand the removal mechanism of brittle material and to master the way of the different processing parameters affecting the surface quality.…”
Section: Introductionmentioning
confidence: 99%
“…Grinding with bound abrasives has been extensively used in forming and finishing components of many materials [1][2][3][4][5].The demand of parts associated with the advanced optical technology is increasing due to the growth and the expansion of the optical industry. Especially, super-precision optical parts associated with IT, NT and BT requires the high antideviation to accomplish the ultra precision machining.…”
Section: Introductionmentioning
confidence: 99%