Grinding Mode Identification by Means of Surface Characterization

Trumpold, H.; Hattori, M.; Tsutsumi, Chiaki; Melzer, Carsten

doi:10.1016/s0007-8506(07)62257-4

Cited by 10 publications

(4 citation statements)

References 11 publications

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“…Some qualitative aspects are presented in [2], [8] and [9] which show that by increasing the vibration amplitude, it also increases: the height of workpieces surface micro-roughness and the specific pressure pulsation of superfinishing. The elastic systems of superfinishing machines are considered as possessing a single degree of freedom.…”

Section: Dynamic Criterionmentioning

confidence: 99%

Optimal Design of Brittle Materials Superfinishing Machine

Dobrescu¹,

Pascu²,

Nicolescu³

et al. 2012

Proceedings of the 23rd International DAAAM Symposium 2012

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This paper reviews theoretical and experimental research regarding brittle materials processing with superfinishing machine. The optimization of the characteristics of brittle materials superfinishing machine is very important because they directly influence the quality of workpieces surfaces. The performances of the superfinishing machine linkages are increasingly higher, due to the following requirements: very high quality workpieces surface, reduced time for feed workpieces to machine tools, better interconnections between machine tools are used in the technological process, high flexibility. Main criteria for optimal design of brittle material superfinishing machine are: energy consumption criterion, technological criterion, dynamic criterion.

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Section: Dynamic Criterionmentioning

confidence: 99%

Optimal Design of Brittle Materials Superfinishing Machine

Dobrescu¹,

Pascu²,

Nicolescu³

et al. 2012

Proceedings of the 23rd International DAAAM Symposium 2012

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“…Instead, the newly formed surface produced by AJM resulted from so-called`mild wear' of the ceramic material [10]. It is considered that the material removal takes place in a ductile manner, by microfracture within the grains rather than by grain boundary cracking [11]. In the case of LBM, the face of the generated dimple was considerably diVerent from that of AJM.…”

Section: Geometrical and Topographical Features Of Microdimplesmentioning

confidence: 99%

Influence of micromachining on strength degradation of silicon nitride

Wakuda

Yamauchi

Kanzaki

2002

Proceedings of the Institution of Mechanical Engineers, Part B:

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In recent years, much research has been devoted to the development of micromachining technologies for ceramic materials. This paper investigates two kinds of machining methods capable of dimpling a ceramic surface with highly controlled precision: abrasive jet machining (AJM) and laser beam machining (LBM). A comparative discussion of the geometrical and topographical characteristics of microdimples machined on to an Si3N4 surface is first presented, followed by the main topic, an examination of the effects of micromachining on the strength degradation of ceramics. Dimpling by LBM cannot be prevented from forming a sharp edge around the dimple bottom face, which may degrade the flexural strength of the ceramic considerably. In contrast, the AJM dimple has a smooth-faced rounded shape, and only negligible deterioration of the strength takes place.

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“…Since the dimension and the density of the cracks are extremely small; it is extremely difficult to capture those cracks. To evaluate grinding results, usually subjective methods are applied, and the distinction between ductile mode and brittle mode in grinding is usually made by means of human visual evaluation of microscopic photographs from optical microscope, SEM or AFM after grinding [1,2]. If all the surface fracture disappears, ductile mode grinding was usually thought to be obtained.…”

Section: Introductionmentioning

confidence: 99%

A Method for Grinding Mode Identification in Grinding of Silicon Wafers

Huo

Jin

Kang

et al. 2007

AMR

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A new non-destructive method was developed to identify the grinding mode of silicon wafers, which is based on the information of subsurface cracks extracted from the surface topography of the ground silicon wafers measured with a 3D surface profiler. We examined extensive measurement data of the surface topography of silicon wafers processed by single grain grinding or real grinding operation, and our results show that the information about median cracks could be captured if the lateral sampling interval of the 3D surface profiler is small enough, even if the grain depth of cut is below 20nm. If the maximum valley of the measured surface topography is approximately equal to the grain depth of cut, surface formation will be under ductile mode, whereas, if the maximum valley is several times larger than the grain depth of cut, surface formation will be under brittle mode. According to this criterion, silicon wafers ground by ductile mode or brittle mode could be identified rapidly and conveniently. Experimental validation shows that this method is accurate.

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Grinding Mode Identification by Means of Surface Characterization

Cited by 10 publications

References 11 publications

Optimal Design of Brittle Materials Superfinishing Machine

Optimal Design of Brittle Materials Superfinishing Machine

Influence of micromachining on strength degradation of silicon nitride

A Method for Grinding Mode Identification in Grinding of Silicon Wafers

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