Groove depth uniformization in [110] Si anisotropic etching by ultrasonic wave and application to accelerometer fabrication

Ohwada, K.; Negoro, Y.; Konaka, Y.; Oguchi, T.

doi:10.1109/memsys.1995.472546

Cited by 17 publications

(8 citation statements)

References 6 publications

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“…All mold inserts are fabricated from 8-mm square silicon wafers. Anisotropic wet etching and (110) silicon wafers are used to fabricate the mold inserts with surface micro-channels that are wider than 1 µm, with widths of 20, 10 and 2 µm, and aspect ratios of over 12 [10][11][12][13]. E-beam lithography and (100) silicon wafers are used to fabricate the other mold inserts whose surface sub-micron channels have aspect ratios of about six.…”

Section: Micro-injection Molding Experimentsmentioning

confidence: 99%

Injection molding of polymer micro- and sub-micron structures with high-aspect ratios

Liou

Chen

2005

Int J Adv Manuf Technol

134

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This work studies the injection molding characteristics of polymer micro-and sub-micron structures using demonstration mold inserts with micro-and sub-micron channels with high-aspect ratios. The effects of the injection molding parameters on the achievable aspect ratio of the micro-and sub-micron walls were investigated. Additionally, distinctive mold-filling behaviors and resulting defects were observed for various polymers, such as polymethyl methacrylate (PMMA), polypropylene (PP) and high-density polyethylene (HDPE). Experimental results reveal that the mold temperature determines the success of the injection molding of micro-and sub-micron walls. The satisfactory mold temperature for micro-injection molding significantly exceeds that for traditional injection molding. Moreover, the main injection pressure and the main injection time substantially affect the achievable aspect ratio of the micro-and sub-micron walls. Furthermore, unusual flow behaviors occur and poor molding results are obtained when PP and HDPE are used for micro-injection molding.

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Section: Micro-injection Molding Experimentsmentioning

confidence: 99%

Injection molding of polymer micro- and sub-micron structures with high-aspect ratios

Liou

Chen

2005

Int J Adv Manuf Technol

134

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“…Several nonchemical approaches to mitigating the hillocking effect have been tried, including the use of surfactants, the use of ultrasonic agitation, and preemptive chemical elimination of the bubbles, as discussed above. Ohwada et al noted that their use of ultrasonic agitation essentially eliminated surface roughness in KOH etching [46]. 6) Etch-Rate Modulation: As discussed above for individual etchants, highly -doped ( ) silicon regions greatly attenuate the etch rate.…”

Section: ) Control Of Surface Roughnessmentioning

confidence: 99%

Bulk micromachining of silicon

Kovacs

Maluf²,

Petersen³

1998

Proc. IEEE

659

374

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Bulk silicon etching techniques, used to selectively remove silicon from substrates, have been broadly applied in the fabrication of micromachined sensors, actuators, and structures. Despite the more recent emergence of higher resolution, surfacemicromachining approaches, the majority of currently shipping silicon sensors are made using bulk etching. Particularly in light of newly introduced dry etching methods compatible with complementary metal-oxide-semiconductors, it is unlikely that bulk micromachining will decrease in popularity in the near future. The available etching methods fall into three categories in terms of the state of the etchant: wet, vapor, and plasma. For each category, the available processes are reviewed and compared in terms of etch results, cost, complexity, process compatibility, and a number of other factors. In addition, several example micromachined structures are presented.

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“…To accelerate the release of hydrogen bubbles and maintain the etch rate, the etching cell is put in a Dynashock R ultrasonic cleaner made by Honda Electronics to assist the etch process. The cleaner generates ultrasonic waves whose frequency is switched between 28, 45 and 100 kHz at intervals of about 1 ms to enhance the deep groove etching performance [17].…”

Section: Ultrasonic Wave Assistancementioning

confidence: 99%

Macroporous silicon-based deep anisotropic etching

Tao

Esashi

2005

J. Micromech. Microeng.

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A novel micromachining technique for silicon deep anisotropic etching using macroporous silicon is developed. Macroporous silicon is formed selectively in n-type substrates using silicon anodization in a hydrofluoric acid (HF)-based electrolyte with backside illumination. Three-dimensional microstructures are fabricated by removing the macroporous silicon in alkali solutions. This technique enables us to etch (1 0 0) n-type silicon with arbitrary shaped windows to produce high-aspect-ratio structures with vertical sidewalls using a wet etching process.

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Groove depth uniformization in [110] Si anisotropic etching by ultrasonic wave and application to accelerometer fabrication

Cited by 17 publications

References 6 publications

Injection molding of polymer micro- and sub-micron structures with high-aspect ratios

Injection molding of polymer micro- and sub-micron structures with high-aspect ratios

Bulk micromachining of silicon

Macroporous silicon-based deep anisotropic etching

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